IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 10, 2012
Hot Air Solder Leveling in the Lead-free Era
Materials Tech
Embedded Components: Analysis of Reliability
Analysis Lab
The Demise of the Plated-Through Hole?
Board Talk
Improve Etching Performance
Materials Tech
Removal of Oxidation from Bare PCBs
Board Talk
Poor Wetting On OSP Coated PCBs
Board Talk
Board Performance after Pb-Free Reflow
Materials Tech
Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
More Related Programs  »



Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
More Materials Tech  »
New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems

Improve Etching Performance
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Authored By:
Keisuke Yamanishi
Nippon Mining & Metals.Co., Ltd.
This program first published June 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Improve Etching Performance

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
Featured Sponsors  »
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute image
Ultimate Solution for Placement Flexibility
Ultimate Solution for Placement Flexibility
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships