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February 10, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
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Squeegee and Stencil Life
Squeegee and Stencil Life
Is there a recommended usage rate for stencils? Is there a way to determine when it's time to replace a squeege?
This program first published June 2009
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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