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June 18, 2013
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
Board Talk
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Materials Tech
Big Ideas on Miniaturization
Big Ideas on Miniaturization
Production Floor
Sources of ESD in a Production Line
Sources of ESD in a Production Line
Production Floor
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Production Floor
Advanced Second Level Assembly Analysis Techniques
Advanced Second Level Assembly Analysis Techniques
Analysis Lab
Solder Paste Life on the Stencil
Solder Paste Life on the Stencil
Ask the Experts
Printing vs. Dispensing
Printing vs. Dispensing
Board Talk
Step Stencil Design for Handheld
Step Stencil Design for Handheld
Production Floor
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
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Is There a Standard Usage Rate for Stencils?
Is There a Standard Usage Rate for Stencils?
Is there a recommended usage rate for stencils? Is there a way to determine when it's time to replace a squeege?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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