IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
May 21, 2012
Assembly and Reliability of FCBGA and FPBGA
Analysis Lab
Insufficient Plated Hole Fill with Electrolytic Capacitors
Ask the Experts
Soldering Improvement for SMT Connectors
Production Floor
Cold Solder Joints on 0603 Components
Ask the Experts
Control for Cost-Effective Selective Soldering
Production Floor
What Is the Best Way to Reduce Dross?
Board Talk
Inclusion Voiding in Gull Wing Solder Joints
Analysis Lab
Contract Assembly in a Prison
Ask the Experts
High Complexity Lead-Free Wave and Rework
Production Floor
Questions About Soldering to Flex Circuits
Ask the Experts
More Related Programs  »



Chip Component Cracking During Pick/Place
We notice chip resistor cracking during placement. The cracks are in the ...
TSOP Component Soldering Problems
I supervise no-clean, lead-free SMT lines in an area with no control ...
What are the Pros and Cons of Cleaning No-Clean?
With today's newer chemistries, what are the pros and cons of cleaning ...
SMT Components Popping Off During Reflow
One particular SMT component is popping off during the reflow process leaving ...
Can Immersion Gold PCBs Oxidize?
I have immersion gold PCBs that have developed oxidation. Is there a ...
Round vs. Square Stencil Apertures
What is your opinion about using round versus square apertures for BGA ...
Rules for Reusing Electronic Components
If you remove a component from a circuit board, and the component ...
What Is the Best Way to Reduce Dross?
What is the best way to reduce dross? What are all the ...
Risk of Mixing Tin-lead and Lead-free
What are the risks of mixing tin-lead and lead-free components on a ...
When Should You Use Underfill?
We have a circuit board assembly with a wafer level chip scale ...
More Board Talk  »
Leaded Parts Through a Lead-free Wave
Leaded Parts Through a Lead-free Wave
Are there any concerns if we wave solder boards with just a few non-RoHS complaint components? Are we likely to contaminate our wave solder bath?
Print  »

Phil
We're coming to you today from the 44th floor of our glorious Boston office here with a very cloud obscured view of Logan Airport. Today's question is from JB: “Will the assembly circuit boards using RoHS-compliant assembly line; however, the customer does not have a RoHS lead-free requirement. Are there any concerns if we use a few leaded components in this process? Are we likely to contaminate our wave solder bath? “

Jim and Phil
The answer is YES. Don't take the chance!

Jim
This is a classic example of not wanting to introduce anymore variability or chances into your process. Could you put tin lead plated parts through your LF wave soldering? Lead is going to get into that pot. Your limit is 0.1%. Yeah, could you get away with a few parts? Sure.

Is it a good idea? No, it's not because sooner or later the contamination build up in that pot will come back to harm you; and if you contaminate that pot; if you get too much lead in it; you will have to completely drain the pot, flush it.

It's just a very complex and a costly procedure to get that pot back again. But thinking in a more philosophical vein, it's just: Don't enter variability into your process. It's not a good idea. You got a lead-free process; you want to keep it lead-free.

Do not allow any contamination anywhere on the line - parts, stencil, printer, anyplace that contamination can occur. You're taking a risk, and you don't want to introduce additional risks into your process if you don't have to.

Phil
Now chances are you're probably not auditing your incoming components. It would be great if you were, but chances are you're probably not (if you're like most people) and there's a possibility you could have already be running some leaded parts through that pot.

So we recommend strongly to get a feel for what's going on, that you send a sample from your solder pot out for analysis to your solder company or analysis lab to monitor to the various levels of contaminates in your solder bath…

Jim
Absolutely.

Phil
You should do this more frequently at the front end until you get a good feel for what's going on there.

Jim
Right, but keeping tin lead and lead-free separate has been a continuing logistical problem. Don't take any chances. And with process concerns such as contaminating a pot, taking risk is just not worth it.

Phil
Absolutely.

Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Leaded Parts Through a Lead-free Wave

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Authentication
Please type the number displayed into the box. If you attempt to submit information and receive an error, you may need to refresh the page and insert the information again.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight   »
Featured Sponsors   »
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships

Views: 873