IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
 IPC OUTLOOK Logo
February 3, 2012
Related Programs  »
From the Single Chip to Wafer Integration
Materials Tech
Memory Minaturazation to Extend Moore's Law
Technology Briefing
Challenges of Package on Package Devices
Materials Tech
Gold Stud Bump Flip Chip Attachment
Materials Tech
Embedded Packaging Technologies
Materials Tech
Evaluation of POP Assembly Under Load
Production Floor
PCB Assembly for 3D Package-on-Package
Production Floor
Design for Flip-Chip and Chip-Size Technology
Materials Tech
Solder Bumping for Flip Chip Technology
Materials Tech
Advances in Graphene Transistors
Technology Briefing
More Related Programs  »


Materials Tech  »
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design and research ...
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and ...
The Digital Solder Paste
This paper discusses a process for creating a digital solder paste using ...
Flux Cored Wire Solder Shelf Life Study
Paper covers an investigation that a two year shelf life recommendation is ...
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny ...
Conformal Coating for Tin Whisker Management
The objective of this study is to evaluate conformal coatings for mitigation ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions ...
Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test conditions is ...
Board Performance after Pb-Free Reflow
This paper will focus on air-air thermal cycling, IST testing and material ...
Elimination of Whiskers from Electroplated Tin
Paper covers data to show the effect of two approaches on the ...
More Materials Tech  »
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec

Design for Flip-Chip and Chip-Size Technology
Design for Flip-Chip and Chip-Size Technology
This paper provides a comparison of flip-chip and wafer level array package methodologies detailed in IPC-7094.
Authored By:
Vern Solberg
Solberg Technology Consulting
Madison, Wisconsin
This program first published May 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Comments  »
Use the form below to submit a comment.
No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Design for Flip-Chip and Chip-Size Technology
The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
Lead-free Compatible Selective Soldering
Lead-free Compatible Selective Soldering
The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems
Featured Sponsors  »
Surface Mount and BGA Pad Repair... Really?
Surface Mount and BGA Pad Repair... Really?
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
Circuit Technology Center
Innovative No-clean, Halide-free Tacky Flux
Innovative No-clean, Halide-free Tacky Flux
Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
Henkel Corporation
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
 There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America
Ultimate Solution for Placement Flexibility
Ultimate Solution for Placement Flexibility
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships