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Unheard of Price for a Rework System
It's almost impossible to perform today's complex rework without split-vision. The Manncorp lead-free BR-710 desolders, removes and replaces BGAs and QFPs.
Manncorp
Qualification of Thin Form Factor PWBs
Paper presents qualification testing of thin PWBs for warpage, cross section, shear testing, and more for long-term reliability.
Authored By:
Mumtaz Y. Bora
Kyocera Wireless Corporation
San Diego, CA 92121 USA
This program first published May 2009
Materials Tech programs cover topics including: Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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Today's Sponsor
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IPC Member Spotlight »
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
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Featured Sponsors »
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APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
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Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic
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PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
Henkel Electronics
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
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