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February 10, 2012
Hot Air Solder Leveling in the Lead-free Era
Materials Tech
Embedded Components: Analysis of Reliability
Analysis Lab
The Demise of the Plated-Through Hole?
Board Talk
Improve Etching Performance
Materials Tech
Removal of Oxidation from Bare PCBs
Board Talk
Poor Wetting On OSP Coated PCBs
Board Talk
Board Performance after Pb-Free Reflow
Materials Tech
Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
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Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free ...
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected ...
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with ...
Design of New Solder Attach Technologies
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Next Generation PoP Pastes
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Lead-free Development in Server Applications
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Unheard of Price for a Rework System
Unheard of Price for a Rework System
It's almost impossible to perform today's complex rework without split-vision. The Manncorp lead-free BR-710 desolders, removes and replaces BGAs and QFPs.
Manncorp

Qualification of Thin Form Factor PWBs
Qualification of Thin Form Factor PWBs
Paper presents qualification testing of thin PWBs for warpage, cross section, shear testing, and more for long-term reliability.
Authored By:
Mumtaz Y. Bora
Kyocera Wireless Corporation
San Diego, CA 92121 USA
This program first published May 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
Featured Sponsors  »
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
PCB Protection Overview
PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
Henkel Electronics
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
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