Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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I have this USB 4-pin connectors using pin 'n paste process in one of our high runner boards. I just noticed it today (after 1200 boards) that the solder paste being pushed-out the 4 pins at the bottom side is dripping and accumulating inside the oven mostly on the 2nd to 3rd zone (temp is 120deg.c to 140 deg. c) of our 12-zone Vitronics oven.
Question is, is this normal? Or what is the normal inside the oven for pin n' paste process. The protrusion of the 4 pins at the bottom side is 1mm.
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Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
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Question is, is this normal? Or what is the normal inside the oven for pin n' paste process. The protrusion of the 4 pins at the bottom side is 1mm.
Rodolfo del Mundo