IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
May 24, 2013
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Materials Tech
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Board Talk
How to Gauge Solder Paste Volume?
How to Gauge Solder Paste Volume?
Board Talk
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
Production Floor
Mixed Technology - Which First
Mixed Technology - Which First
Ask the Experts
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
Production Floor
More Related Programs  »
Featured Sponsor - please stay tuned ...   »
Business Iintelligence is Crucial to Sustained Success
Business Iintelligence is Crucial to Sustained Success
Trends is a solid source, an informed source, that will tell you what trends to expect -- and how you can profit from them.
Trends Audio Magazine

Max Idle Time After Print, Before Reflow
Max Idle Time After Print, Before Reflow
What is the maximum allowable time for a PCB after it leaves the screen printer but before reflow? We're using water soluble lead-free paste.
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  » Submit a Comment  »


This is highly dependent on the solder paste formulation. We have a few brands that can withstand 24 hours between printing and placement of components. Some grades only leave a 6 hour window. Our typical minimum specification for any new development is 8 to 24 hours for no clean paste, 8 hours for water soluble paste.


Mitch Holtzer, Alpha Metals



Dear Click and Clack,

errr...I forget your names on the show!

Nice tribute to Car Talk, my favorite Saturday Morning radio show! Of course its my only Saturday morning show...

Anyway my question is I'm not clear what you do at 1" upside down. Do you tap it on the surface below, or just invert it? What is 90 degrees? And is the implicit assumption is that if parts fall off the paste is too dry to reflow?

Hope you guys are doing well in this challenging economy!


Bob Drake, Philips-Assembleon

Sponsors   »
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships
Programs: 900+  |  Directory Listings: 1450+  |  IPC Members: 3100+
Subscribers: 100,000+


Views: 5241