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February 10, 2012
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Max Idle Time After Print, Before Reflow
Max Idle Time After Print, Before Reflow
What is the maximum time for a PCB to sit idle after screen printing but before reflow?
This program first published March 2009
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
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A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
This is highly dependent on the solder paste formulation. We have a few brands that can withstand 24 hours between printing and placement of components. Some grades only leave a 6 hour window. Our typical minimum specification for any new development is 8 to 24 hours for no clean paste, 8 hours for water soluble paste.


Mitch Holtzer, Alpha Metals
Dear Click and Clack,

errr...I forget your names on the show!

Nice tribute to Car Talk, my favorite Saturday Morning radio show! Of course its my only Saturday morning show...

Anyway my question is I'm not clear what you do at 1" upside down. Do you tap it on the surface below, or just invert it? What is 90 degrees? And is the implicit assumption is that if parts fall off the paste is too dry to reflow?

Hope you guys are doing well in this challenging economy!


Bob Drake, Philips-Assembleon
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