Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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On what basis is the stencil thickness decided in case of BGA's or fine chip components.
sudha.S, Epigon Media Technologies pvt. ltd
These brothers by different mothers didn't even bring up the most robust solder paste print solution, i.e., a two pass screen print process. The 1st pass print would use a 4 mil thick stencil for the CSPs and ultra fine pitch ICs, etc.
The second pass print would use a 6 mil thick stencil for all other components with bottom side etch out areas over the 1st pass print component footprints. This two pass screen print process is utilized in high volume production for the 1st pass RoHS exempt high-Pb Flip Chip assembly with eutectic Sn63Pb37 solder paste, followed by the 2nd pass Pb-Free solder paste print for all other packages.
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sudha.S, Epigon Media Technologies pvt. ltd
The second pass print would use a 6 mil thick stencil for all other components with bottom side etch out areas over the 1st pass print component footprints. This two pass screen print process is utilized in high volume production for the 1st pass RoHS exempt high-Pb Flip Chip assembly with eutectic Sn63Pb37 solder paste, followed by the 2nd pass Pb-Free solder paste print for all other packages.
Guy Rupp, Maxim Integrated Products