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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Problems with Reflow Oven Profiles?
Problems with Reflow Oven Profiles?
What are the proper attachment methods when using thermocouples to record temperatures when conducting reflow profiles.
Authored By:
Zarrow Hall
This program first published January 2009
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
Nice session on TC attachment. It took me a couple seconds to realize that you were saying BOARD talk, not BORED talk, but that is just the effect of the cold New England weather.

We sometime forget that new folks don't know the basics or older folks (including me) begin taking shortcuts that get us into trouble. Kapton tape at the TC tip is one of those easy to do short cuts.

The high temp solder (usually hi lead 90/10) and thermal epoxies (good to 290 for short times) are good ways to attach the TC's. But they usually require that we sacrifice a board, and it takes some effort to prepare. I agree with the KIC guys that the aluminum tape with Kapton tape as a strain relief is great method. It is quick, non-permanent, and holds the tip of the TC in intimate contact with the joint.


Fred Dimock, Manager, Process Technology, BTU International
We have medium volume and high mix and we are using tape too with good results.

Sergio Ilescas Hernandez, Arris Group de mexico, Mexico
The Rochester Institute of Technology just conducted a study on TC attachment. Phil and Jim you were dead on. I was kind of surprised high temp solder tested so poorly. Interesting how slow it is to respond in the all important peak zone of your profile. The study also showed aluminum tape with the best results.

See: Thermocouple Attachment Results are in!


Brian O'Leary, KIC
Good to see your piece on connecting thermocouples. In our everyday life we see still a lot of customers struggling with this and then not measuring the real temperatures they need to measure. Keep going strong.

Marc Dalderup, Rehm Thermal Systems
Hey guys, nicely done. I like the car-talk like format, it is fun. Mike Limberg and I just got done writing a book on profiling, we used the dummies like format and had a lot of fun with it.

We have a whole section on TC attachment. We are a big fan of conductive Aluminum tape, used along with Kapton for strain relief like you mention in your podcast. We talk about high temp solder and epoxy which can work also, but like you said you got to be careful of mass. Lot of times we see unequal amounts applied per TC that can throw your readings. What is your take on aluminum tape, realizing of course it is a non permanent solution?


Brian O'Leary, KIC
Below is a link to a site with we send our customers to with respect to TC attachment. We have found that alumimum tape is a fast secure way to attach TC's. Many of our customers are High Mix Low Volume and can not scrap a board, they must ship all the bare baords they receive. http://profilingguru.com/

Michael Limberg, KIC
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Problems with Reflow Oven Profiles?

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