A lead-free solder paste that performs like ... Indium 8.9 helps increase first-pass yields, finished goods performance and operational profitability.
Videos and Programs
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Next Generation PoP Pastes This paper highlights some of the differences between traditional solder pastes and PoP solder pastes. Materials Tech
Optimization to Prevent the Graping Effect This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon. Production Floor
The Effects of Flux Residues on Reliability Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance. Analysis Lab
A Robust Fine Feature Printing Process This paper evaluates many fine printing stencil factors that have an increased effect on the transfer efficiency of solder pastes. Production Floor
Solder Fortification with Preforms PIP has been used for several decades, but it's not always possible to print enough paste to obtain an acceptable joint. This paper covers design and assembly techniques using solder performs. Materials Tech
Understanding Surface Insulation Resistance This paper covers differences between two of the industry's most common surface insulation resistance (SIR) specifications J-STD-004A and J-STD-004B. Materials Tech
Lead-Free Flux and Influence on Cleaning Lead-free flux technology is more difficult to clean. Cleaners with a better matching solvency for the residues are needed. Production Floor
Stencil Printing: Circular vs. Square Apertures Paper covers practices for optimizing the printing process focusing on comparison of large/small and square vs. round apertures. Production Floor
Best Practices - Reflow Profiling for Lead-free Paper covers best practices for optimizing the reflow process to meet challenges of higher temperatures, smaller deposits and decreased powder size. Analysis Lab
Stencil Printing for Miniaturized Electronics Paper covers experimental data and process optimization techniques employed to establish a precision SMT printing process. Production Floor
Voiding Control at QFN Assembly Thermal pad voiding control at QFN assembly is a major challenge due to the large coverage area, large number of via, and low standoff. Analysis Lab
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor packaging, solar photovoltaic, and thermal management markets.
Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science.
