IPC Outlook - electronics manufacturing and assembly programs

The Knowledge and Know-how Connection

February 22, 2012

Welcome to IPC Outlook »

Board Reliability »

Reliability Requirements Go Up, Budgets Go Down

Maintaining the reliability needed in space is becoming more difficult as budgets tighten.

Electronics Assembly »

IPC International Conference in Budapest Highlights Soldering Assembly and Inspection

Get a competitive edge in eastern Europe's fast-growing electronics market.

IPC APEX EXPO® »

Keynote Panel Forecasts Game Changers in the Industry

Five IPC APEX EXPO keynote panelists will examine critical issues.

Last Chance to Check Out New Products and New Solutions

IPC APEX EXPO is your one-stop-shopping event to see and compare the newest products and equipment and to network with the experts and leaders in the industry.

Meet and Eat

Join other participants at IPC APEX EXPO for a local dining experience.

IPC Events »

Present at IPC Midwest Technical Conference

The IPC Midwest Technical Conference is seeking technical experts to make presentations on the materials and processes that contribute to the performance of printed board assemblies.

IPC Member Milestones »

New IPC members and companies celebrating membership anniversaries.

PPG Industries Inc. recently celebrated its 20th year as an IPC member. See other companies celebrating membership anniversaries.

Member Anniversaries - New Members

Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

IPC Multimedia Training »

Handling in Electronics Assembly

PREVIEW

Designed to help prevent handling defects and reduce scrap.

IPC Blog »

Industry Growth Slowed in 2011 with Signs of Recovery at Year End

IPC Calendar »

February 28 - March 1
Exhibition - IPC APEX EXPO® 2012

March 15
Webinar: Discussion and Highlights of IPC-4204A, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

March 22-23
Conference on Electronics Assembly: Soldering, Assembly & Inspection, Budapest, Hungary

IPC Outlook Statistics »
Programs: 750+
Directory Listings: 1300+
IPC Members: 3100+
Newsletter Subscribers: 100,000+

Sandy Gentry, Editor
Kim Sterling, Publisher
Neal Bender, Membership Director

Failure Mechanism in Embedded Capacitors

Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric.
Analysis Lab

Reliability of Coated WLCSP Components

Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill.
Analysis Lab

Lifted Leads on QFP Components

After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause?
Ask the Experts

The Design Process Just Got Easier

Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits

Max Interval Between Reflow for OSP Boards

With OSP coated circuit boards, what is the maximum allowable and recommend time interval between reflow of the first and second sides to insure proper wetting.
Board Talk

Printable Materials for Electronic Packaging

This paper reports on novel printable materials that have the potential to surpass conventional materials.
Materials Tech

Advanced Nanomaterial Cooling Systems

Researchers have developed a new method for creating advanced nano-materials that could lead to super-efficient cooling systems.
Technology Briefing

Nanotechnology for Lead-free Final Finishes

Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability.
Materials Tech

How To Determine Stencil Thickness

On what basis is stencil thickness decided in the case of BGA's or fine pitch components? The Assembly Brothers dive in.
Board Talk

Poor Metrology: The Hidden Cost

Paper compares and contrasts acquiring a Cpk value from an external metrology system versus one from an internal system.
Supply Chain

Advances in Monitoring of Stencil Printing

Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print.
Production Floor

What Causes Solder Fillet Peaks

We are soldering a screw with a single point solder robot that leaves a peak in the solder joint. What is causing this defect?
Ask the Experts

Private Space Flight Takes Off

The anticipated emergence of private spaceflight is taking place. What will this mean for the technology, the companies involved, and NASA?
Technology Briefing

How Many Zones Needed for Lead-free Profile?

How many zones are required to run a lead-free profile? Does the number of zones dictate capability or do they only matter for throughput?
Ask the Experts

Lubricant Causes Quality Problems

Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science

Comments »

Unusual Contamination
Feb 15, 2012 - This is more of a comment... the subject on "unusual contamination"... I have seen this ...
Fran Guminsky, Honeywell

Alternatives to Conformal Coating
Feb 15, 2012 - Would it be possible to have all electronic parts constructed where the pins & leads ...
Tomas Geronimo, Sanmina-SCI Corp., USA

Today's Sponsor

IPC Member Spotlight »

The Design Process Just Got Easier

Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits

Featured Webcast »

Economic Insights - February 2012

What is the outlook for the economy? We'll give you all the insights and analysis you need to make better decisions - so you can make better profits.

Featured Sponsors »

New Standards in Dispensing Technology

The new Scorpion can dispense up to 100,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec

The Design Process Just Got Easier

Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits

PCBs are MSDs

IPC-1601 PCB Guidelines state, "board fabricators and users should strive to avoid baking by practicing effective handling, packaging, storage, and process controls..." Learn how ...
Super Dry

Printing Focused on Useful Technology

EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America

IPC Training & Certification from Blackfox

Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute

Lead-free Compatible Selective Soldering

The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems

High Speed Underfill & Coating in One System

The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK

Leader in Fluid Dispensing, Coating, and Jetting

Asymtek world leader in automated fluid dispensing, supplies automated fluid dispensing systems backed by a global support network.
Nordson ASYMTEK

IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher

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