 |
AI Technology, Inc.
|
 |
CAPLINQ Corporation
|
 |
Conductive Compounds, Inc.
|
 |
Cytec Industries Inc.
|
 |
Diemat, Inc.
|
 |
Dymax Corporation
|
 |
Ellsworth Adhesives
|
 |
Emerson & Cuming
|
 |
Engineered Materials Systems, Inc.
|
 |
Epoxy Technology, Inc
|
 |
EXFO Life Sciences & Industrial Division
|
 |
FLEXcon
|
 |
Glue Dots International
|
 |
Henkel Electronics
|
 |
Heraeus Materials Technology, LLC
|
 |
Hexion Specialty Chemicals
|
 |
Indium Corporation
|
 |
INTERTRONICS
|
 |
Inventec Performance Chemicals
|
 |
IRphotonics
|
 |
Kaneka Texas Corporation
|
 |
Krayden, Inc.
|
 |
Master Bond, Inc.
|
 |
Mid America (UK) Ltd
|
 |
Permabond
|
 |
SABIC Innovative Plastics
|
 |
Senju Comtek Corporation
|
 |
SimChem Corporation
|
 |
Star Technology, Inc.
|
 |
Techcon Systems
|
 |
Tesa AG
|
 |
ThreeBond Europe S.A.S.
|
 |
Umicore AG & Co. KG
|
 |
United Resin Corporation
|
 |
YINCAE Advanced Materials, LLC
|
 |
Zymet Inc.
|
|
|
|
1 of 4
|
Adhesives, sealants, epoxies, glues, tapes and materials for bonding including high temperature epoxy adhesives, structural, flexible, rigid and cyanoacrylate epoxy adhesives.
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the ...
CAPLINQ is a team of professionals, comprised mainly of engineers that work with customers to solve exactly these problems.
With ...
Conductive Compounds, Inc. develops & manufactures
electrically conductive & resistive inks, UV dielectrics, adhesives,
coatings, encapsulants & other materials for ...
Cytec Industries Inc. is a global specialty chemicals and materials company focused on developing, manufacturing and selling value-added products. Our ...
Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages. This technology replaces the more ...
DYMAX manufactures RoHS-compliant industrial bonding resins including light-curable adhesives, coatings, and sealants, epoxy resins, cyanoacrylates, and masking materials.
DYMAX also ...
Ellsworth Adhesives is a global corporation specializing in the distribution of specialty chemicals and equipment. We distribute a wide range ...
Provides adhesives, coatings and encapsulants for circuit and component assembly applications. ...
Engineered Materials Systems, Inc. is a leading global formulator of structural adhesives, coatings and adhesives, conductives, encapsulants, potting compounds and ...
Epoxy Technology is one of the leading manufacturers of specialty adhesives for use in advanced technology applications.
The worlds' most ...
|
|
1 of 4
|
|
Today's Sponsor
|
|
IPC Member Spotlight
»
|
Lead-free Compatible Selective Soldering
The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems
|
|
Featured Sponsors
»
|
Time for an upgrade?
ECD's thermal profiler has 1.5 million data points, onboard T/C readiness & internal storage of up to 96 profiles. It's the Smartest Profiler on the Planet.
ECD
|
Benefits of Electrolytic Solder
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.
|
Fully Automatic Inline Stencil Printer
Tucano is a high-precision, automatic inline printer with exceptional alignment repeatability and quick change over on a small footprint.
Essemtec
|
Leader in Fluid Dispensing, Coating, and Jetting
Asymtek world leader in automated fluid dispensing, supplies automated fluid dispensing systems backed by a global support network.
Nordson ASYMTEK
|
PCBs are MSDs
IPC-1601 PCB Guidelines state, "board fabricators and users should strive to avoid baking by practicing effective handling, packaging, storage, and process controls..." Learn how ...
Super Dry
|
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
|
|