Ziptronix, a leader in developing next-generation semiconductor integration strategies and processes, makes tomorrow’s high performance IC applications available today.
Based on the patented room temperature wafer bonding process, ZiBond and Direct Bond Interconnect (DBI) enable 3D architectures with the smallest footprint and the smallest volumetric size of any technologies available.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
