Reactive NanoTechnologies, Inc. was founded in 2001 to develop and manufacture its patented technology, NanoFoil®. NanoFoil® is used to precisely control the instantaneous release of heat energy for advanced joining applications providing superior performance and value to the user.
The company has also developed its patented NanoBond® joining process to simplify manufacturing and ensure the benefits of NanoFoil® are maximized. NanoBond® is used today to bond sputter targets and in several electronics assembly applications including LED assembly and thermal management.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
