Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services.
Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.
Videos and Programs
1 of 1
8000 Wire Bonder The 8000 Wire Bonder is a fully automatic, thermosonic, high-speed gold bumper, ball and wire bonder, capable of improving production yields and eliminating sources of variation in your processes. Directory Videos
3800 Die Bonder This flexible, computer-controlled die bonder and automated component placement system performs up to three channels of adhesive dispense, eutectic die attach and flip chip operations over a large work area. Directory Videos
6500 Die Bonder Overview The 6500 Die Bonder offers a balanced combination of accuracy, speed and flexibility in a compact system footprint. Directory Videos
Hi-Rel Wire Bonding The 8000 Wire Bonder is a fully-automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Directory Videos
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
