Oerlikon Esec is a leading global provider of chip assembly equipment, processing techniques and system solutions for the semiconductor industry. Our equipment and solutions are utilized in what is known as the backend segment of semiconductor production.
The core business encompasses die attach (Die Bonders and Flip-Chip Bonders) and wire bonding (Wire Bonder) products.Oerlikon Esec is part of the Oerlikon Components segment.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
