Nihon Handa's R&D efforts in recent years have been focused on the development of lead-free joining materials, which include: Lead Free Solders in various forms, Bar Solder, Solder Paste, Cored Solder and Solder Spheres are available in PF27 (Sn/Ag/Cu) and PF33 (Sn/Ag/Cu/Bi) alloys.
Specially formulated no-clean paste fluxes will endure long, high-temperature preheating environment to achieve good wetting of lead-free solder.
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