The Integrated Electronics Engineering Center (IEEC), which was established in 1991, pursues research in electronics packaging. This field deals with the process of bringing a semiconductor chip, with its resident circuitry, to a form that can be integrated effectively into a larger microelectronics assembly.
Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
