HEPCO, Inc. has designed and built component lead forming equipment. Working with some of the world's largest sub-contract assemblers and OEMs here in the fast-paced Silicon Valley environment places HEPCO in a unique position in the industry.
Our vast client list encompasses the smallest start-up companies to the largest in EMS, aerospace and semiconductor manufacturing, for whom we provide lead forming solutions from single-stroke forming to bowl-fed systems.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
