Henkel's leading brands of Ablestik, Acheson, Hysol, Loctite and Multicore have long been recognized as the product brands to trust for printed circuit board assembly applications.
With a broad portfolio of materials including surface mount adhesives, printed inks, advanced flux chemistries, encapsulants, traditional tin-lead and high performance lead-free solder solutions, conductive adhesives as well as CSP underfills and board protection materials, Henkel's advanced formulations ensure maximum processability and reliable in-field performance.
Represented in over 80 countries, Henkel has manufacturing sites in strategic locales throughout the world, ensuring customers have immediate product access and time-sensitive customer support.
Videos and Programs
1 of 1
Enhancing Reliability of PB-Free Solder Joints This paper reviews the physical properties of different underfills and how they affect performance through reliability testing. Materials Tech
Developing a New Lead-Free Alloy This paper discusses the process for development of a new lead free alloy for high reliability, high temperature applications. Materials Tech
PCB Protection with Macromelt Low pressure molding is an innovative manufacturing process between injection molding and potting. Directory Videos
Innovative No-clean, Halide-free Tacky Flux Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications. Directory Videos
Flux and Under-fill in a Single Material This breakthrough epoxy flux material combines flux function and under-fill protection in a single material. Directory Videos
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
