Offers new technologies in Pine chemistry to preserve the environment.
Micro-soldering technology has received much attention in the electronic packaging area due to the progress in flip-chip interconnection technology as well as the increase in the demand for fine pattern circuit boards.
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IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
