Forty years of putting the customer at the centre of its strategy have led to the Dage Group being firmly and successfully established in the electronics market.
Dage have developed a wide range of capabilities and solutions that are further enhanced by designing and developing many of the core technologies that underpin its products.
Videos and Programs
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Challenges of Package on Package Devices Paper outlines the process associated with soldering stacked packages using dip flux and dip solder paste designed to overcome the incidence of package warp. Materials Tech
Analysis of Voiding Under QFN Packages Paper covers results of experiments on QFN devices when the ensuing voiding level was calculated by x-ray inspection. Analysis Lab
Modern 2D / 3D X-Ray Inspection Paper reviews methods of finding defects in BGAs, QFNs, and 3D packages using X-Ray inspection with real-life examples. Analysis Lab
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
