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February 22, 2012
Maximizing the Value of Automatic Inspection in PCB Assembly
Program: Production Floor
Thermal Cycle Testing of PWBs
Program: Analysis Lab
Void Detection in Solder Balls and Joints
Program: Analysis Lab
Ideas for Identifying Counterfeit Components
Program: Analysis Lab
2D and CT Scan X-ray for Joint Inspection
Program: Analysis Lab
Combination of AOI and AVI Machines
Program: Analysis Lab
Inspection to Improve Lead-Free Solder
Program: Materials Tech
Test Optimization to Improve Rework
Program: Analysis Lab
Flexible Fixturing System for In-Circuit Test
Program: Production Floor
Guide to Understanding Your Testing Lab
Program: Analysis Lab
NASA Lead-Free Project: Mechanical Shock Test
Program: Analysis Lab
Solving Test Challenges: Razor Sharp Probes
Program: Analysis Lab
Analysis of Voiding Under QFN Packages
Program: Analysis Lab
New Paradigm for Optical/X-Ray Inspection
Program: Analysis Lab
Fighting Undesirable Effects of Thermal Cycling
Program: Analysis Lab
Reliability of Sn/Cu/Ni Solder Joints
Program: Analysis Lab
Drop Test For Lead-Free Assemblies
Program: Analysis Lab
Mechanical Failures in Pb-Free Processing
Program: Analysis Lab
Solder Joint Reliability of QFN Packages
Program: Analysis Lab
Modern 2D / 3D X-Ray Inspection
Program: Analysis Lab
Solder Residues and In-Circuit Test
Program: Board Talk
How To Inspect QFN Components?
Program: Board Talk
Solder Creep Fatigue for Lead-Free Joints
Program: Analysis Lab
AOI in an 01005 World
Program: Production Floor
Pb-Free Thermal Cycle Acceleration Factors
Program: Analysis Lab
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
Maximizing the Value of Automatic Inspection in PCB Assembly
Learn about the role of automatic inspections, SPI data mining, typical SMT process defects, and more in this presentation by Chrys Shea, Christopher Associates.
Program: Production Floor
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs exposed to lead-free and rework simulation.
Program: Analysis Lab
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to pre SMT solder balls or post SMT solder joints.
Program: Analysis Lab
Ideas for Identifying Counterfeit Components
Expert Bob Willis explains some nondestructive methods for identifying counterfeit components - before they go on your boards.
Program: Analysis Lab
2D and CT Scan X-ray for Joint Inspection
Paper discusses the combination of conventional 2D X-ray inspection and CT scan techniques and shows various illustrations of defects which are normally difficult to detect.
Program: Analysis Lab
Combination of AOI and AVI Machines
AOI and AVI machines have different functions. This paper analyses the combination of AOI and AVI machines to save cost, labor and space.
Program: Analysis Lab
Inspection to Improve Lead-Free Solder
Paper reviews defects uncovered by a high performance inspection system and merits of capturing images of defects.
Program: Materials Tech
Test Optimization to Improve Rework
Paper reviews how to use test machines to diagnose defects and how to reduce defects from a SMT line.
Program: Analysis Lab
Flexible Fixturing System for In-Circuit Test
Paper describes a flexible fixturing system which overcomes the cost and tooling cycle times inherent with traditional BoN fixtures.
Program: Production Floor
Guide to Understanding Your Testing Lab
Paper covers test methods specific to the various global eco-compliance directives as well as the different instrumentation used for these types of analyses.
Program: Analysis Lab
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