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The Knowledge and Know-how Connection
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May 22, 2013
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1 of 6
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.
| Voiding Control at QFN Assembly |
Thermal pad voiding control at QFN assembly is a major challenge due to the large coverage area, large number of via, and low standoff.
Program: Analysis Lab
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| Integrated Electrical Test Within the Production Line |
This paper discusses the advantages of a universal integrated electrical test solution, at the normal in-circuit test stage of production, to minimize production costs and help improve product quality.
Program: Production Floor
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| X-rays vs. Cross Sections to Measure Voids |
This paper validates void measurements obtained from non-destructive imaging techniques, with the physically measured void measurements of cross sectioning.
Program: Analysis Lab
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| Fatigue Behaviour of Reflowed Joints |
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays and high density interconnect structures.
Program: Analysis Lab
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| Evaluating Surface Cleanliness |
The water break test is easy and practical to conduct and helps you evaluate residues left from adhesives or conformal coating dots.
Program: Analysis Lab
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| Boundary Scan Advanced Diagnostic Methods |
In this paper several cases will be presented to illustrate how use of circuit information and predictive analysis of potential assembly faults will provide more precise and accurate diagnostic information.
Program: Production Floor
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| Pb-Free Thermal Cycle Acceleration Factors |
Paper discusses the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb.
Program: Analysis Lab
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| Revolutionary Technique for Microvia Microsections |
This paper describes the design of a novel test structure that facilitates the evaluation of blind and buried microvias in printed circuit boards, in comparison with existing, standard test coupons.
Program: Analysis Lab
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| Explanation of PoP Inspection Techniques |
Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies.
Program: Analysis Lab
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| Drop Test Performance of BGA Assemblies |
In this work, BGA solder spheres using SAC105 with 0.02% addition of Titanium were evaluated for BGA assembly drop test performance.
Program: Analysis Lab
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Sponsors
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Quickturn now includes Slots & Cutouts
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Sunstone Circuits 
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PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
Henkel Electronics 
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Counterfeit components - MUST you know?
MUST 3 Solderability testing can help identify counterfeit components. Compares the force measurement signatures quickly and easily.
Gen3 Systems Limited 
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Faster, Easier and Smarter Jetting
NexJet™ features the one-piece, Genius™ Jet Cartridge. Built-in memory records jetting data and software controls the jetting process. Learn more...
Nordson ASYMTEK 
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Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc. 
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Discover New Facts About Parylene Coating
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT 
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Do You Have Qualified Rework Technicians?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center 
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Moisture Damage Causes Early Field Failures
All components are susceptible to moisture damage. Even PCBs. These defects can pass through ICT and functional test and they lead to early field failures. Is your CM in control of MSDs?
Super Dry® by Totech 
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