In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components. Program: Analysis Lab
We currently clean reballed BGA components using an ultrasonic cleaner followed by baking to remove any moisture. The components appear very clean after this process. Is this an acceptable practice for cleaning reballed PGA components? Program: Board Talk
Ball Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots. Let's look at the 6 most common mistakes in BGA rework and how you can avoid them. Program: Production Floor
Is it possible to add circuits under leadless devices such as BGA's? Could the part be installed through the normal assembly process? Program: Ask the Experts
Recently reworked BGA components are bridged at the corners. What caused the corners of the BGA component to bridge and how can we prevent it? Program: Ask the Experts
