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June 17, 2013
Ten Rules for Jumper Wires
Program: Production Floor
Overcoming Repair Depot Challenges
Program: Production Floor
Jumper Wire Nightmare!
Program: Production Floor
Best Method for Repairing Underfill Arrays?
Program: Board Talk
Is There a Thermal Cycle Limit?
Program: Board Talk
Rework or Repair?
Program: Ask the Experts
What is the Reliability of Reballed BGAs?
Program: Production Floor
Test Method to Characterize Pad Cratering
Program: Analysis Lab
BGA Site Modification - Is It Possible?
Program: Production Floor
BGA Rework Flux Recommendation
Program: Ask the Experts
Advanced Rework Technology for Large Area Arrays
Program: Production Floor
BGA Reballing and Influence on Ball Shear Strength
Program: Analysis Lab
Time Required to Bake for Repair
Program: Ask the Experts
Can We Skip Cleaning After Rework?
Program: Board Talk
Is Pre-Bake Standard for Rework?
Program: Ask the Experts
Solder Balls During Rework
Program: Ask the Experts
Dip Solder Paste for BGA Rework
Program: Production Floor
Alternative to Dead Bug Rework
Program: Production Floor
BGA Re-balling from Lead-free to Tin-lead
Program: Production Floor
Delamination Dilemma
Program: Ask the Experts
Reworked BGA Bridging at the Corners
Program: Ask the Experts
Cleaning for Reliability Post QFN Rework
Program: Production Floor
Rework for Lead-Free Mirrored BGA Designs
Program: Production Floor
Reliability Assessment of Reballed BGAs
Program: Analysis Lab
Is Rework Unacceptable?
Program: Ask the Experts
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Ten Rules for Jumper Wires
Ten Rules for Jumper Wires
Do you know the rules for attaching jumper wires to assembled circuit boards? This program covers 10 key rules you should know and follow.
Program: Production Floor
Overcoming Repair Depot Challenges
Overcoming Repair Depot Challenges
This paper looks at key issues that should be considered in developing a robust outsourced repair depot strategy.
Program: Production Floor
Jumper Wire Nightmare!
Jumper Wire Nightmare!
A routing miscommunication resulted in a significant problem. The circuit traces for 2 adjacent connectors on a circuit board were switched. What was the solution?
Program: Production Floor
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Mechanically, thermally, chemically, a combination of these methods. Is there an industry approved method?
Program: Board Talk
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
How many thermal cycles should we allow at a given location on a circuit board before we should consider the assembly compromised?
Program: Board Talk
Rework or Repair?
Rework or Repair?
We often need to strip solder splash contamination off gold edge contacts and replate them. Is this considered a repair or a rework? Are there clear definitions for the terms repair and rework?
Program: Ask the Experts
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Will the process of re-balling lead-free BGA components with tin-lead solder balls yield quality connections better or worse than soldering those components using tin-lead solder paste?
Program: Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
In this study, an easy-to-implement test method to quantify the propensity for pad cratering in different PCB materials is presented.
Program: Analysis Lab
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Here we cover a type of BGA site modification that uses a section of circuit track and a jumper wire to complete the modification.
Program: Production Floor
BGA Rework Flux Recommendation
BGA Rework Flux Recommendation
Is there a flux we should evaluate when we replace BGA components? We have problems maintaining activity during BGA rework.
Program: Ask the Experts
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