Reflow Soldering, Profiling Index

The Knowledge and Know-how Connection

May 24, 2013

	Cause of SMT Component Shift? Program: Ask the Experts
	Best Practices - Reflow Profiling for Lead-free Program: Analysis Lab
	Random Lifted Leads on QFP Components Program: Board Talk
	What is the Life Span of a Profile Board? Program: Board Talk
	Tombstoning Dilemma Program: Ask the Experts
	Adding Weights to Small BGAs During Reflow Program: Ask the Experts
	Effect of Cooling Rate on the Intermetallic Solder Joints Program: Production Floor
	How to Re-Certify a Reflow Oven After Moving Program: Ask the Experts
	Effects of Reflow and Flux on Tin Whiskers Program: Analysis Lab
	Why LGA/QFN Packages May Float During Reflow Program: Production Floor
	How Many Zones Needed for Lead-free Profile? Program: Ask the Experts
	Lifted Leads on QFP Components Program: Ask the Experts
	What Causes Solder Skips? Program: Analysis Lab
	What Causes Chip Blow Off During Reflow? Program: Board Talk
	Component Damage From IR Reflow Program: Ask the Experts
	How To Eliminate Pesky Solder Balls? Program: Board Talk
	Help With Defective Solder Joints Program: Board Talk
	What Happens When Tin-lead Is Reflowed at Lead-free Temps? Program: Board Talk
	What Is the Life Span for a Profile Board? Program: Ask the Experts
	BGA Shifting During Reflow Program: Ask the Experts
	Weight Limit for Double Sided Reflow of QFNs Program: Production Floor
	Going Lead Free with Vapor Phase Soldering Program: Production Floor
	What Causes SMT Component Shift? Program: Ask the Experts
	Vapour Phase - Profiling for Lead-Free Alloys Program: Production Floor
	Reflow Optimization for MLP Components Program: Production Floor

Reflow Soldering, Profiling »

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These programs cover reflow soldering, profiling, data collection and more.

Cause of SMT Component Shift?

We are running the exact same boards through identical ovens, yet we're experiencing component shift with only one oven. What is the reason and the solution?
Program: Ask the Experts

Best Practices - Reflow Profiling for Lead-free

Paper covers best practices for optimizing the reflow process to meet challenges of higher temperatures, smaller deposits and decreased powder size.
Program: Analysis Lab

Random Lifted Leads on QFP Components

After placement and reflow, we have a random lifted lead problem on some QFPs. What might be the cause? Where should we look?
Program: Board Talk

What is the Life Span of a Profile Board?

What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why?
Program: Board Talk

Tombstoning Dilemma

We're having a problem with small chip tombstoning. I'm curious to read your input on the possible cause and how we can eliminate it.
Program: Ask the Experts

Adding Weights to Small BGAs During Reflow

Do you think it makes sense to add a weight to the top of the small BGA's during reflow to improve soldering and reduce opens?
Program: Ask the Experts

Effect of Cooling Rate on the Intermetallic Solder Joints

This report covers a study of the effect of cooling rates on copper-tin crystals. The effect of isothermal aging at intermediate temperatures was also studied.
Program: Production Floor

How to Re-Certify a Reflow Oven After Moving

After moving a reflow oven what steps need to be performed on the machine and the heat exhaust system to re-certify?
Program: Ask the Experts

Effects of Reflow and Flux on Tin Whiskers

Paper covers tin whisker formation on solders fillets of QFPs with 3 different concentrations of HBr activated fluxes.
Program: Analysis Lab

Why LGA/QFN Packages May Float During Reflow

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.
Program: Production Floor

Reflow Soldering, Profiling »

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