After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause? Program: Ask the Experts
With OSP coated circuit boards, what is the maximum allowable and recommend time interval between reflow of the first and second sides to insure proper wetting. Program: Board Talk
How many zones are required to run a lead-free profile? Does the number of zones dictate capability or do they only matter for throughput? Program: Ask the Experts
What causes solder bridging on BGAs? Could it be moisture sensitivity, excessive solder paste, mismatched reflow profile or something else? Program: Ask the Experts
Many companies have not found the right solutions to change over to lead free yet. Vapor phase reflow soldering can be an answer. Program: Production Floor
Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints. Program: Analysis Lab
