Flip-Chip, MEMS, Semiconductors Index

The Knowledge and Know-how Connection

June 18, 2013

	Evaluation of Molded Flip-chip BGA Packages Program: Analysis Lab
	Gold Stud Bump Flip Chip Attachment Program: Materials Tech
	Challenges of Package on Package Devices Program: Materials Tech
	Assembly of Fine Pitch PoP Components Program: Production Floor
	Embedded Packaging Technologies Program: Materials Tech
	Solder Bumping for Flip Chip Technology Program: Materials Tech
	Flip Chip Package Qualification Program: Materials Tech
	Investigation of Pad Cratering in Large Flip-Chip BGA Program: Analysis Lab
	New Technologies for Ultra Thin Chips Program: Materials Tech
	No-Clean Flux Residue and Underfill Compatibility Program: Materials Tech
	How to Achieve High Speeds Without Breaking the Bank Program: Production Floor
	Design for Flip-Chip and Chip-Size Technology Program: Materials Tech
	Update - The Revolution in MEMS Program: Technology Briefing
	From the Single Chip to Wafer Integration Program: Materials Tech
	Evaluation of POP Assembly Under Load Program: Production Floor
	The Latest in Cheap Micro Surgical Cameras Program: Technology Briefing
	Using Light in New Computer Chips Program: Technology Briefing
	PCB Assembly for 3D Package-on-Package Program: Production Floor
	Advances in Computer Chip Core Technology Program: Technology Briefing
	When Should You Use Underfill? Program: Board Talk
	Memory Minaturazation to Extend Moore's Law Program: Technology Briefing
	Advances in Graphene Transistors Program: Technology Briefing
	The Huge Potential of Micro-Sensors Program: Technology Briefing
	Breakthrough at the Nanoscale Program: Technology Briefing
	Breakthrough - Ultra Low Power Digital Memory Program: Technology Briefing

Flip-Chip, MEMS, Semiconductors »

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These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Evaluation of Molded Flip-chip BGA Packages

The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Program: Analysis Lab

Gold Stud Bump Flip Chip Attachment

Flip chip bonding is a desirable attachment approach for minimizing size. This paper compares immersion and auto catalytic gold plating processes for flip chip bonding.
Program: Materials Tech

Challenges of Package on Package Devices

Paper outlines the process associated with soldering stacked packages using dip flux and dip solder paste designed to overcome the incidence of package warp.
Program: Materials Tech

Assembly of Fine Pitch PoP Components

Paper focuses different assembly variations for PoP components with .4 mm pitch on the lower package and .5mm pitch on the upper package.
Program: Production Floor

Embedded Packaging Technologies

Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Program: Materials Tech

Solder Bumping for Flip Chip Technology

Paper presents new cost-efficient solder bumping and adapted assembly technologies for processing flip-chips.
Program: Materials Tech

Flip Chip Package Qualification

Paper reviews qualification efforts for solder interconnects on interposer substrates, X-ray and cross-sectional analysis of packages and process optimization efforts to improve reliability.
Program: Materials Tech

Investigation of Pad Cratering in Large Flip-Chip BGA

Study covers a technique used to systematically investigate pad cratering in a daisy chain flip-chip BGA package.
Program: Analysis Lab

New Technologies for Ultra Thin Chips

Paper shows different approaches to use ultra-thin chips for new packages with high density and improved performance.
Program: Materials Tech

No-Clean Flux Residue and Underfill Compatibility

This paper covers an experiment designed to measure the electrical reliability of various combinations of underfill and no-clean flux residues.
Program: Materials Tech

Flip-Chip, MEMS, Semiconductors »

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IPC — Association Connecting Electronics Industries
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Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director