Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric. Program: Analysis Lab
Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability. Program: Materials Tech
Paper aims at analyzing and confirming the reliability performance of embedded components compared to that of standard SMT components. Program: Analysis Lab
How long do you expect the industry will continue to use through hole components? I can envision connectors being used for some time, but what about the other component types? Program: Board Talk
What would be the best method or product for cleaning bare PCBs that have a small amounts of oxidation? I know that proper storage and handling may solve the problem, but what would you suggest? Program: Board Talk
We are experiencing poor wetting on one OSP coated PCB using a lead-free, no clean paste. We see this problem on just one board part number. Where should we look to solve this problem? Program: Board Talk
