Contamination, Defects, Whiskers Index

The Knowledge and Know-how Connection

May 24, 2013

	The Effects of Flux Residues on Reliability Program: Analysis Lab
	What is Causing Oxidation? Program: Ask the Experts
	Corrosive Driven Whisker Growth in SAC305 Program: Analysis Lab
	Sticky Residue Under Low Clearance Parts Program: Board Talk
	Issues with Circuit Boards Exposed to Rain Program: Ask the Experts
	Lead-Free Solder Contaminated with Lead Program: Ask the Experts
	Are Gloves Required for PCB Handling? Program: Board Talk
	Tombstone Chip Caps Revisited Program: Production Floor
	Effects of Tin and Copper on Tin Whisker Formation Program: Analysis Lab
	Impact of Dust on PCB Assembly Reliability Program: Analysis Lab
	Early Detection of PCB Pad Cratering Failures Program: Analysis Lab
	Investigation of Whisker Growth on Wire and Braid Program: Analysis Lab
	Is There a Passive Component Solder Void Limit? Program: Board Talk
	Does Contamination Affect Whisker Formation? Program: Analysis Lab
	False Tin Whiskers: Masquerading Intermetallic Program: Analysis Lab
	Last Will and Testament of the BGA Void Program: Analysis Lab
	Cause of Unusual Contamination? Program: Ask the Experts
	Head and Pillow SMT Failure Modes Program: Analysis Lab
	What Causes Oxidation on SMT Pads? Program: Ask the Experts
	Fracture Prediction in Lead-Free Joints Program: Analysis Lab
	Cause of Voids in Leadless Packages Program: Ask the Experts
	Effects of Whiskers on Nanocrystalline Copper Program: Analysis Lab
	Intermittent Connector Failures in Electronic Assemblies Program: Analysis Lab
	Head-On-Pillow Defect - A Pain in the Neck Program: Analysis Lab
	Effect of Soldering and Flux on Whisker Growth Program: Analysis Lab

Contamination, Defects, Whiskers »

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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

The Effects of Flux Residues on Reliability

Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance.
Program: Analysis Lab

What is Causing Oxidation?

After 2-3 months of service in the field we are noticing the silver connectors on our circuit board assemblies have turned black, and appear to have heavy oxidation. Is anyone familiar with this problem?
Program: Ask the Experts

Corrosive Driven Whisker Growth in SAC305

This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Program: Analysis Lab

Sticky Residue Under Low Clearance Parts

We are finding a tacky substance, the consistency of rubber cement, underneath a large surface mount component. Is this residue common when no-clean leaded solder paste is used with large, no clearance parts? What causes this?
Program: Board Talk

Issues with Circuit Boards Exposed to Rain

We have a circuit board that was exposed to rain water, but has been operational for 14 months. Is there a likelihood of failure at this stage compared to other boards?
Program: Ask the Experts

Lead-Free Solder Contaminated with Lead

Our wave solder pot contains lead free solder. Analysis indicates it contains 0.12% lead. The maximum allowed is 0.10% lead. Is there anything we can do to promptly bring the lead concentration into compliance?
Program: Ask the Experts

Are Gloves Required for PCB Handling?

How important are gloves when handling circuit boards prior to wave soldering or reflow soldering? Phll Zarrow and Jim Hall review the topic.
Program: Board Talk

Tombstone Chip Caps Revisited

Tombstone defects for chip components are on the increase. Is it time to evaluate plating sensitivity when chip components are reflow soldered?
Program: Production Floor

Effects of Tin and Copper on Tin Whisker Formation

This study examines the effect of adding grain refiners during tin electroplating with a focus on the associated incidence of whiskering.
Program: Analysis Lab

Impact of Dust on PCB Assembly Reliability

What are the key characteristics of dust? Are some dust types worse than others? Should there be classifications of dust? This paper presents some results towards answering these questions.
Program: Analysis Lab

Contamination, Defects, Whiskers »

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