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May 24, 2013
The Effects of Flux Residues on Reliability
Program: Analysis Lab
What is Causing Oxidation?
Program: Ask the Experts
Corrosive Driven Whisker Growth in SAC305
Program: Analysis Lab
Sticky Residue Under Low Clearance Parts
Program: Board Talk
Issues with Circuit Boards Exposed to Rain
Program: Ask the Experts
Lead-Free Solder Contaminated with Lead
Program: Ask the Experts
Are Gloves Required for PCB Handling?
Program: Board Talk
Tombstone Chip Caps Revisited
Program: Production Floor
Effects of Tin and Copper on Tin Whisker Formation
Program: Analysis Lab
Impact of Dust on PCB Assembly Reliability
Program: Analysis Lab
Early Detection of PCB Pad Cratering Failures
Program: Analysis Lab
Investigation of Whisker Growth on Wire and Braid
Program: Analysis Lab
Is There a Passive Component Solder Void Limit?
Program: Board Talk
Does Contamination Affect Whisker Formation?
Program: Analysis Lab
False Tin Whiskers: Masquerading Intermetallic
Program: Analysis Lab
Last Will and Testament of the BGA Void
Program: Analysis Lab
Cause of Unusual Contamination?
Program: Ask the Experts
Head and Pillow SMT Failure Modes
Program: Analysis Lab
What Causes Oxidation on SMT Pads?
Program: Ask the Experts
Fracture Prediction in Lead-Free Joints
Program: Analysis Lab
Cause of Voids in Leadless Packages
Program: Ask the Experts
Effects of Whiskers on Nanocrystalline Copper
Program: Analysis Lab
Intermittent Connector Failures in Electronic Assemblies
Program: Analysis Lab
Head-On-Pillow Defect - A Pain in the Neck
Program: Analysis Lab
Effect of Soldering and Flux on Whisker Growth
Program: Analysis Lab
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These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.
The Effects of Flux Residues on Reliability
The Effects of Flux Residues on Reliability
Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance.
Program: Analysis Lab
What is Causing Oxidation?
What is Causing Oxidation?
After 2-3 months of service in the field we are noticing the silver connectors on our circuit board assemblies have turned black, and appear to have heavy oxidation. Is anyone familiar with this problem?
Program: Ask the Experts
Corrosive Driven Whisker Growth in SAC305
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Program: Analysis Lab
Sticky Residue Under Low Clearance Parts
Sticky Residue Under Low Clearance Parts
We are finding a tacky substance, the consistency of rubber cement, underneath a large surface mount component. Is this residue common when no-clean leaded solder paste is used with large, no clearance parts? What causes this?
Program: Board Talk
Issues with Circuit Boards Exposed to Rain
Issues with Circuit Boards Exposed to Rain
We have a circuit board that was exposed to rain water, but has been operational for 14 months. Is there a likelihood of failure at this stage compared to other boards?
Program: Ask the Experts
Lead-Free Solder Contaminated with Lead
Lead-Free Solder Contaminated with Lead
Our wave solder pot contains lead free solder. Analysis indicates it contains 0.12% lead. The maximum allowed is 0.10% lead. Is there anything we can do to promptly bring the lead concentration into compliance?
Program: Ask the Experts
Are Gloves Required for PCB Handling?
Are Gloves Required for PCB Handling?
How important are gloves when handling circuit boards prior to wave soldering or reflow soldering? Phll Zarrow and Jim Hall review the topic.
Program: Board Talk
Tombstone Chip Caps Revisited
Tombstone Chip Caps Revisited
Tombstone defects for chip components are on the increase. Is it time to evaluate plating sensitivity when chip components are reflow soldered?
Program: Production Floor
Effects of Tin and Copper on Tin Whisker Formation
Effects of Tin and Copper on Tin Whisker Formation
This study examines the effect of adding grain refiners during tin electroplating with a focus on the associated incidence of whiskering.
Program: Analysis Lab
Impact of Dust on PCB Assembly Reliability
Impact of Dust on PCB Assembly Reliability
What are the key characteristics of dust? Are some dust types worse than others? Should there be classifications of dust? This paper presents some results towards answering these questions.
Program: Analysis Lab
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