After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause? Program: Ask the Experts
The head on pillow defect is becoming more common. This paper describes an occurrence for an OEM and explains how it was dealt with. Program: Analysis Lab
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering details during root cause analysis. Program: Analysis Lab
The head-in-pillow defect has become a relatively common failure since the implementation of lead-free technologies. This paper addresses the three sources or contributing issues (supply, process & material) of head-in-pillow defects. Program: Analysis Lab
Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance. Program: Analysis Lab
This paper describes critical factors affecting head and pillow and how to identify the root cause and give potential solutions to prevent the defect. Program: Analysis Lab
Paper covers data to show the effect of two approaches on the dissipation of the stress, resulting from intermetallic compound formation. Program: Materials Tech
Study examines applicability of solder joint fracture initiation criteria that would permit the prediction of solder joint strength. Program: Analysis Lab
