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February 22, 2012
Limitations of DI-Water Cleaning Processes
Program: Production Floor
pH Neutral vs. Alkaline Cleaning Agents
Program: Analysis Lab
Ultrasonic Cleaning Causing Damage
Program: Ask the Experts
Removing Flux from Low Standoff Heights
Program: Production Floor
Organic Flux Residue Concerns
Program: Ask the Experts
Is Baking Required After Water Cleaning?
Program: Board Talk
How Clean is Clean?
Program: Production Floor
Cleaning No-Clean Solder Paste
Program: Ask the Experts
Collaborative Cleaning Process Innovations
Program: Production Floor
Why Switch From Pure DI-Water to Chemistry
Program: Production Floor
Effects of Ultrasonic Cleaning
Program: Ask the Experts
Cleaning No Clean Boards With IPA
Program: Board Talk
Hard Water Contamination
Program: Ask the Experts
Mixed Cleaning - No Clean and Water Soluble
Program: Board Talk
Lead-Free Flux and Influence on Cleaning
Program: Production Floor
Flux Residue Visible After 3 Months
Program: Ask the Experts
Solvent Attacking Flex Circuits
Program: Ask the Experts
Defluxing for New Assembly Requirements
Program: Production Floor
Cleaning to Remove Solder Balls
Program: Ask the Experts
Cleanliness of Stencils and Misprinted Boards
Program: Production Floor
Cleaning PCBs - Understanding Todays Needs
Program: Production Floor
New Cleaning Agents for No-Clean Fluxes
Program: Analysis Lab
Steam Cleaning PCB Assemblies
Program: Ask the Experts
Stagnant DI Water Usage
Program: Ask the Experts
Cost Comparison: Batch and Inline Cleaners
Program: Production Floor
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These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.
Limitations of DI-Water Cleaning Processes
This case study is a comprehensive blind study to determine removability with DI-water versus various chemistry supported systems.
Program: Production Floor
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Program: Analysis Lab
Ultrasonic Cleaning Causing Damage
What method can be used to prevent damage to sensitive SMT components during the ultrasonic cleaning process?
Program: Ask the Experts
Removing Flux from Low Standoff Heights
Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues from beneath low standoff height components.
Program: Production Floor
Organic Flux Residue Concerns
What concerns should we have with reliability if we skip cleaning after rework? Our processes will leave organic flux residues on our boards.
Program: Ask the Experts
Is Baking Required After Water Cleaning?
Do circuit board assemblies need to be baked after routine aqueous cleaning? If so, how long and at what temperature?
Program: Board Talk
How Clean is Clean?
For over 40 years, the electronics industry has been seeking ways to determine an answer to the thorny old question: How clean is clean?
Program: Production Floor
Cleaning No-Clean Solder Paste
We are removing no-clean residue after reflow using a brush and no-clean cleaner that is causing white residue. What do you suggest?
Program: Ask the Experts
Collaborative Cleaning Process Innovations
This paper reports on mechanical and chemical innovations that open the process window for circuit board cleaning.
Program: Production Floor
Why Switch From Pure DI-Water to Chemistry
The purpose of this paper is to report a timely direct comparison between a pure DI-water process and a chemically assisted application.
Program: Production Floor
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