We have hundreds of programs in the IPC Outlook database. Each program is categorized into a Channel based on the subject. Check back often, we add new programs every week.
Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric. Program: Analysis Lab
Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill. Program: Analysis Lab
After placement and reflow, we are having a random lifted lead problem on some QFP's. Is a 1% fall out rate normal? What might be the cause? Program: Ask the Experts
With OSP coated circuit boards, what is the maximum allowable and recommend time interval between reflow of the first and second sides to insure proper wetting. Program: Board Talk
Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability. Program: Materials Tech
Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print. Program: Production Floor
We are soldering a screw with a single point solder robot that leaves a peak in the solder joint. What is causing this defect? Program: Ask the Experts
