What is the industry consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework? Program: Ask the Experts
We mistakenly assembled boards using BGA components with moisture tags that show indication of moisture exposure. Can we rebake the assemblies? Program: Ask the Experts
I understand from some sources that PCB baking is not necessary if the PCB is Vacuum Packed by the PCB supplier. Is this true? Program: Ask the Experts