Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print. Program: Production Floor
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness due to the presence of T SOPS and QFP packages. What do you advise? Program: Board Talk
Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible. Program: Production Floor
For either Type III or Type IV solder paste, should there be a minimum number of solder spheres deposited on each surface mount pad? Program: Board Talk
Paper examines some of the solderless assembly methods used over the years, and looks forward at some solutions that might lie in the future. Program: Production Floor
This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon. Program: Production Floor
Stencil positional accuracy is a function of the manufacturing process. This paper covers the various parameters that influence positional accuracy. Program: Production Floor
