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February 22, 2012
How To Determine Stencil Thickness
Program: Board Talk
Advances in Monitoring of Stencil Printing
Program: Production Floor
Problems With Starved "J" Lead Joints
Program: Board Talk
Assembly Options for Handheld Products
Program: Production Floor
Improve Scheduling in Electronics Assembly
Program: Supply Chain
Solder Paste and the 5 Ball Rule
Program: Board Talk
Past, Present, Future of Solderless Assembly
Program: Production Floor
Optimization to Prevent the Graping Effect
Program: Production Floor
Stencil Manufacturing and Impact on Precision
Program: Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Program: Ask the Experts
A Robust Fine Feature Printing Process
Program: Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Program: Board Talk
Pick and Place to Insert Radial Lead Devices
Program: Board Talk
Optimizing Print Process for Mixed Technology
Program: Production Floor
Stencil Considerations - Miniature Components
Program: Production Floor
New Control Chart for Electronics Assembly
Program: Supply Chain
Controlling the Assembly Process Using SPC
Program: Supply Chain
Design for Assembly of 01005 Components
Program: Materials Tech
Estimating Stencil Life
Program: Production Floor
Effect of Squeegee Blades on Print Quality
Program: Production Floor
Recommended Lead to Hole Ratio
Program: Ask the Experts
Reliability Modeling of Circuit Card Assemblies
Program: Analysis Lab
Stencil Design Improves Drop Test Performance
Program: Materials Tech
Evaluation of New SMT Stencil Materials
Program: Analysis Lab
Stencil Thickness For Mixed Density Boards
Program: Board Talk
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These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
How To Determine Stencil Thickness
On what basis is stencil thickness decided in the case of BGA's or fine pitch components? The Assembly Brothers dive in.
Program: Board Talk
Advances in Monitoring of Stencil Printing
Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print.
Program: Production Floor
Problems With Starved
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness due to the presence of T SOPS and QFP packages. What do you advise?
Program: Board Talk
Assembly Options for Handheld Products
Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible.
Program: Production Floor
Improve Scheduling in Electronics Assembly
Paper describes a scheduling method known as the hybrid flow shop as applied to surface mount assembly production flow.
Program: Supply Chain
Solder Paste and the 5 Ball Rule
For either Type III or Type IV solder paste, should there be a minimum number of solder spheres deposited on each surface mount pad?
Program: Board Talk
Past, Present, Future of Solderless Assembly
Paper examines some of the solderless assembly methods used over the years, and looks forward at some solutions that might lie in the future.
Program: Production Floor
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon.
Program: Production Floor
Stencil Manufacturing and Impact on Precision
Stencil positional accuracy is a function of the manufacturing process. This paper covers the various parameters that influence positional accuracy.
Program: Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Is there a process that can be used to re-plate component leads to add Pb?
Program: Ask the Experts
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