Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill. Program: Analysis Lab
The paper addresses the issue of underfill as die thickness diminishes, the interconnection bumps get smaller and their number increases. Program: Materials Tech
Is it possible to eliminate conformal coating from seeping into connector holes? How much coating residue is acceptable in the connector holes? Program: Ask the Experts
We are having problems with epoxy bonding to RoHS boards. Is there something about RoHS boards that make them more difficult to bond? Program: Ask the Experts
Prior to conformal coating, how long can we keep a circuit board assemblies in an open condition before they will be impacted by moisture absorption? Listen as the Assembly Brothers cover this topic. Program: Board Talk
This program explains four techniques for removing solder mask including grinding, milling, chemical stripping, and micro-blasting. Program: Production Floor
