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September 20, 2014
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Standards, Technology & Manufacturing   »
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to Cover More Advanced Technologies
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to Cover More Advanced Technologies
Two seminal standards for electronics assemblies, IPC J-STD-001 and IPC-A-610, have been updated to their F revisions. They now cover more advanced technologies than the previous versions, and they're also easier to understand.
Standards, Technology & Manufacturing   »
First Manufacturing Acceptability Standard for Solar Assemblies Debuts
First Manufacturing Acceptability Standard for Solar Assemblies Debuts
IPC-8701, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly, will help companies increase volumes and hold costs down and obtain common acceptance requirements between customers and manufacturers.
Market Research   »
Total PCB Production in 2013 Estimated at $59.4 Billion According to IPC World PCB Production Report
Total PCB Production in 2013 Estimated at $59.4 Billion According to IPC World PCB Production Report
The world market for PCBs declined an estimated 2.2 percent in real terms in 2013; although real growth in North America was positive at 0.8 percent, according to IPC's World PCB Production Report for the Year 2013.
Government Relations   »
U.S. Congress Holds Briefing on National Network for Manufacturing Innovation
U.S. Congress Holds Briefing on National Network for Manufacturing Innovation
On September 18, the four lead sponsors for the Revitalize American Manufacturing and Innovation (RAMI) Act, jointly hosted a special congressional briefing on the National Network for Manufacturing Innovation (NNMI).
Electronics Assembly   »
European Workshops on Best Practices in Electronics Assembly
European Workshops on Best Practices in Electronics Assembly
This October, Phil Zarrow, president and principal consultant, ITM Consulting, will present two half-day workshops in Poland, Austria and Hungary on Understanding and Implementing Best Practices in Electronics Assembly Processes.
Certification Quality Initiative   »
IPC's Certification Quality Initiative (CQI) Embraces Technology
IPC's Certification Quality Initiative (CQI) Embraces Technology
IPC's CQI is embracing technology and has invested in a new online portal to streamline the way we conduct testing and certification. Benefits include improved exam security and data integrity, reduced registration time and more.
High Reliability   »
IPC Europe High Reliability Forum Covers Reliability of Today's High Technology Electronics Products
IPC Europe High Reliability Forum Covers Reliability of Today's High Technology Electronics Products
Co-developed by senior technologists from top organizations likeAirbus, The European Space Agency, Gen3 Systems, Robert Bosch and Thales, this Forum will explore critical reliability issues facing electronics designers and manufacturers.
IPC Multimedia Training   »
Soldering Terminals
Soldering Terminals
Free Review
Best-practices for soldering wires to common terminals, including: turret, cup, bifurcated, hook and pierced terminals.
IPC Calendar   »
Sept. 28-Oct. 2, 2014 - Rosemont, Ill.
Co-located with SMTAI

IPC Fall Standards Development Committee Meetings
October 14-15, 2014 - Düsseldorf, Germany
IPC Europe High Reliability Forum
October 28-30, 2014 - Raleigh, NC
IPC Tech Summit
November 18-20, 2014 - Chicago, Ill.
High-Reliability Cleaning and Conformal Coating Conference
December 3-5, 2014 - Shenzhen, China
International Printed Circuit and APEX South China Fair (HKPCA & IPC Show)
IPC Member Milestones   »
Electrotek Corp. (Oak Creek, Wisc.) recently celebrated its 30th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

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How Frequently Should We Recheck Profiles?
How Frequently Should  We Recheck Profiles?
Is it necessary to replicate thermal profiling during long-term mass production? Is it necessary to recheck accuracy of reflow oven profiles periodically? If so, how frequently.
Board Talk
Dissruptive Innovation - Magnetic Refrigeration
Dissruptive Innovation - Magnetic Refrigeration
The refrigeration market has been ripe for disruption for decades. Now, a new technology called "magnetic cooling" may be on the verge of doing just that.
Technology Briefing
Mixing Different SAC305 Solders
Mixing Different SAC305 Solders
We have been using SAC305 bar solder from one supplier. We now want to source it from a different supplier. Should we be concerned if we mix the new bar solder in with the current solder in our wave soldering systems?
Ask the Experts
MBT-350: A Complete, All-In-One, Rework Station
PACE
The MBT-350 includes 3 individual channels and is capable of delivering hot air and solder suction all at an affordable price.
PACE Incorporated
Manufacture of Aluminum Substrate PCBs
Manufacture of Aluminum Substrate PCBs
This paper describes a new fab method that uses an aluminum substrates that house fully tested and burned in components to create a component board.
Materials Tech
Cleaning PCBs - Understanding Todays Needs
Cleaning PCBs - Understanding Todays Needs
This paper covers the mastery to manage all parameters of the cleaning process while facing miniaturization and environmental care, like ROHS and REACH.
Production Floor
Improving Density in Microwave Multilayer PCBs
Improving Density in Microwave Multilayer PCBs
Paper presents work performed to achieve LCP-based high density multilayer structures, describing the different breadboards manufactured and tested and presents the results.
Analysis Lab
Flexible Fixturing System for In-Circuit Test
Flexible Fixturing System for In-Circuit Test
Paper describes a flexible fixturing system which overcomes the cost and tooling cycle times inherent with traditional BoN fixtures.
Production Floor
Discover New Facts About Parylene Coating
Diamond MT
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT
Reliability of Automated Soldering vs. Hand Soldering
Reliability of Automated Soldering vs. Hand Soldering
Can you comment on the potential differences in reliability for SMT machine placement followed by reflow soldering vs. hand placement followed by hand soldering of surface mount components?
Ask the Experts
Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
This paper reviews a new low global warming potential fluorinated solvent for precision cleaning. The paper covers the properties and performance of the new solvent.
Materials Tech
Conformal Coating Over No-clean Flux
Conformal Coating Over No-clean Flux
Is it normally acceptable to apply conformal coating directly over circuit boards assembled with no clean flux?
Board Talk
Service Robots Connected to the Cloud
Service Robots Connected to the Cloud
The emergence of the cloud over the last decade has opened almost unlimited capabilities to small mobile devices and service robots located anywhere.
Technology Briefing
Micro-line Screen Printing Advancement
Chromaline
NEW Chromaline Alpha® emulsions for printing circuits from 20 to 100 microns—a cost effective manufacturing option for tomorrow's compact electronics.
Chromaline
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
The goal of this study was to identify and qualify an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab
Effect of Squeegee Blades on Print Quality
Effect of Squeegee Blades on Print Quality
This study will report on the effects of squeegee blade thickness along with blade surface finish on solder paste print quality.
Production Floor
Guidelines for Pin-in-Paste
Guidelines for Pin-in-Paste
We've tried a combination of 150 micron thick stencil and 1.6 mm thick board, but it seems we never manage to get the right amount of solder into the hole.
Ask the Experts
Epoxy Resin and the Red Gas Cloud
Epoxy Resin and the Red Gas Cloud
A chemist mixed epoxy and a catalyst that caused an overheated reaction producing a reddish gas cloud. What caused this reaction?
Mysteries of Science
Sponsors   »
New IPC Certification App...
EPTAC
Finally an App to find an IPC Certification or Solder Training class near you. Interactive map, advanced searching all in your hand and all by EPTAC.
EPTAC
Revision "F" is here!
EPTAC
Order the new revisions of IPC-A-610F and J-STD-001F now and start coming up to speed on the new industry criteria and requirements.
Soldertraining, Inc.
eSurface is the Game Changer for the PCB Industry
eSurface
eSurface enables you to: • Achieve Ultra-fine capability < 1/1 L/S; • Dramatically improve yields; • Reduce steps & cycle times; • Maximize efficiency
eSurface
Smart Thermal Profiling
ECD
Proper measurements and robust data collection = superb, repeatable thermal processes. Make the intelligent choice with SuperM.O.L.E.® Gold 2.
ECD
Electronic manufacturing for less than 2EUR/h
Asscon
The VP800 vapor phase reflow soldering system stands for "top performance" on limited space and offers electronic production for less than 2 EUR/h.
ASSCON
Blackfox New Course: High Temp Soldering
BLACKFOX
This hands-on course is designed to address many situations in Electronics Manufacturing where it is necessary to use high melting point solder.
Blackfox Training Institute
Benefits of Electrolytic Solder
Metallic Resources
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.
UV Conformal Coatings with Moisture Cure
Dymax
Dymax light-cure conformal coatings, for high-density PCBs with shadow areas, cure with ambient moisture over time. Download Conformal Coating guide.
DYMAX Corporation
Underfilling Using Continuous Path Motion
Asymtek
White paper for underfill applications and using continuous motion of the dispense head to avoid backtracking and improve units per hour by 27%. Download now.
Nordson ASYMTEK
Flux and Under-fill in a Single Material
Henkel
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
Dual Lane / Dual Temperature SMT Reflow
HELLER
Dual chamber reflow oven allows 2 separate thermal profiles with up to 100 deg temperature difference to run simultaneously. Learn more...
Heller Industries
A World of Reflow Soldering Solutions
Vitronics Soltec
Vitronics Soltec's reflow ovens provide unmatched ease of use. Esterline Technologies says their XPM3i reflow "is an engineer's dream come true!"

Vitronics Soltec
New High-speed Modular Chip-shooter
JUKI
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
Tough Engineering Changes? Where Can You Turn?
CTC
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center
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