IPC Outlook - Electronics Manufacturing and Assembly Programs

The Knowledge and Know-how Connection

June 18, 2013

Standards and Technology »
Big Ideas on Miniaturization

Clive Ashmore, DEK Printing Machines Ltd., delves into the world of next generation miniaturized SMT devices, in this paper presented at IPC APEX EXPO® 2013.

Market Research »
Slow-but-Steady Growth Ahead for Economy and Electronics Industry

Leading macroeconomic indicators and electronics supply chain indicators point to slow growth in the second quarter of 2013, according to IPC's quarterly report, Electronics Industries Market Data Update.

ROHS2 »
IPC Issues Third Set of Comments on List of Restricted Substances under RoHS2

On June 10, 2013, IPC submitted its third set of comments on the draft methodology for evaluating substances for restriction under Annex II of the RoHS2 Directive.

IPC APEX India »
Save the Date for the Inaugural IPC APEX India

IPC APEX India is your opportunity to see the latest innovations from the world's leading experts and companies in the areas of printed board design and manufacturing, electronics assembly and test.

Component Technology »
Closing the Gap in the PCB to Chip Process

IPC and Amkor are presenting the IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process to help the PCB supply chain and chip manufacturers address the many challenges in IC-to-board-level-interconnections.

Call for Papers »
Present Your Work at IPC Conference on Assembly and Reliability

IPC Southeast Asia has issued a call for papers for the IPC Conference on Assembly and Reliability, October 16, 2013, in Bangkok, Thailand.

Technology, Market Trends, Management Issues »
Creating the Electronics Industry of the Future

The IPC Technology Market Research Council Conference & IPC Management Meetings are the only events in the electronics industry that provide a high-level perspective on technology, market trends and management issues for senior-level decision-makers.

New Releases »
Standards, Translations, Market Research...

View recently released standards, translations, research, documents, presentations, technical papers and more.

Status of Standardization »
Standards for Ballot and Final Drafts

View IPC documents under development.

IPC Multimedia Training »

Soldering Terminals

Free Review

Best-practices for soldering wires to common terminals, including: turret, cup, bifurcated, hook and pierced terminals.

IPC Calendar »

June 19-20, 2013 - Washington, D.C
IPC Capitol Hill Day 2013 -- A Free IPC Members-only Event

August 27-29, 2013 - Bangalore, India
IPC APEX India

September 10-12, 2013 - Chandler, AZ USA
IPC Conference on Component Technology

September 24-26, 2013 - Chicago, IL USA
IPC Technology Market Research Council Conference & IPC Management Meetings

IPC Member Milestones »

Foresite, Inc. recently celebrated its 20th year as an IPC member. See other companies celebrating membership anniversaries.

Member Anniversaries - New Members

Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

Solder Paste Transfer Efficiency - What/Why

I've heard the term transfer efficiency relating to printing. What does this term refer to? What actions impact solder paste transfer efficiency?
Board Talk

High Capacity Wireless Data Transmission

Researchers at the Korea Advanced Institute of Science and Technology developed a low-power version of the 60 gigahertz radio frequency integrated circuit.
Technology Briefing

A Generic Reflow Profile

We have a wide mix of PCB assembly types. Some here propose that we use the same reflow profile regardless of the PCB thickness, thermal mass or component mix? Is there any justification for using one generic reflow profile?
Ask the Experts

Great News If You Rework BGA Components

Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
CircuitMedic

Low Surface Energy Coatings, Rewrites the Area Ratio Rules

This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Materials Tech

Pin in Paste Plus Preforms to Eliminate Wave Soldering

Study investigates use and limitations of machine placed solder preforms during the top-side SMT reflow process for PTH components.
Production Floor

Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies

The goal of this study was to identify and qualify an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies.
Analysis Lab

Improve Etching Performance

This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Materials Tech

Components Lifting During Wave Soldering

We have a problem with components rising while going through wave soldering. We prefer to avoid lead clinching. What do you suggest?
Ask the Experts

Why settle for a Tower instead of Fortress?

Introducing the future in Intelligent Storage Management Systems. Guarantees to keep components safe while allowing for easy and intelligent management of critical inventory. Learn more...
Juki Automation Systems, Inc.

Digitization Enables the Transformation of Our Society

The most invisible revolution in history, the Digital Revolution, is taking place all around us. It is happening out of sight and behind the scenes. What are the implications? What do you need to know to make the most if it?
Technology Briefing

What Causes Blow Holes?

What could be causing blow holes on clinched radial lead components? The Assembly Brothers discuss this odd condition.
Board Talk

Big Ideas on Miniaturization

This paper will investigate the impact of miniaturisation and heterogeneous assembly on the print process and strategies to keep one generation ahead.
Production Floor

White Discoloration After Ultrasonic Cleaning

We are using halogen free solder paste SAC305 type no clean. We are cleaning using an ultrasonic cleaning system. After cleaning there is a white discoloration on the soldered areas. What could be the cause?
Ask the Experts

Advances in Conductive Inks Across Multiple Applications

In this paper the authors review both traditional and emerging applications for printed electronics, with a focus on the printed functional materials.
Materials Tech

Sources of ESD in a Production Line

It is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation gives an overview about possible causes for ESD in a SMT production line.
Production Floor

Problems With Viscosity and the Moon

At an English shampoo factory near the sea, they were having problems with the shampoo viscosity. What was the cause?
Mysteries of Science

Featured Webcast »

Electronics Assembly Cleaning - Top to Bottom

This webcast consists of 10 individual program segments
focused on the important topic of electronics assembly cleaning.

Sponsors »

New Standards in Dispensing Technology

The new Scorpion can dispense up to 120,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec

Counterfeit Component Certification

Get the latest training on dealing with and detecting counterfeit components in your supply chain or manufacturing environment. Learn more about this new certification.
EPTAC Corporation

Programmable Batch Vapor Phase Soldering

Handles PCBs to 20 x 20". LCD touchscreen & elevator control for profiles w/ preheat, soak, & time-above-liquidus. Built-in vapor recovery. See video.
Manncorp

Heller Shanghai Celebrates 10 Year Anniversary

Heller will be celebrating its 10th year in Shanghai, with manufacturing, R&D Center and Applications Lab. Congratulations! Click to learn more...
Heller Industries Inc.

PCBs are MSDs

IPC-1601 PCB Guidelines state, 'board fabricators and users should strive to avoid baking by practicing effective handling, packaging, storage, and process controls.' Learn how ...
Super Dry® by Totech

Quickturn now includes Slots & Cutouts

You can now select Slots and Cutouts on Quickturn orders with lead times as short as 24 hours, and at a lower price than ever before. Learn more...
Sunstone Circuits

Why Use EMI / RFI Shielding

EMI / RFI shielding products protect electronics from damaging electromagnetic radiation. Learn more...
Diamond MT

Excellent Electrically Insulative Epoxy

Master Bond Supreme 11AOHT is a two part epoxy for high performance bonding and sealing featuring superior temperature resistance and bond strength.
Master Bond Inc.

Cleanliness - Ionically It Makes A Difference

Fast, accurate & affordable process control to help avoid dendrites / corrosion / tin whiskers. NEW CM Series Closed-Loop ROSE Testers.
Gen3 Systems Limited

You Can Rent an X-ray System Before Buying

Glenbrook's patented, award winning, x-ray imaging technology is simple to use and affordable. Try us, you can rent before you buy. Learn more...
Glenbrook Technologies

Most Energy Efficient Inspection Lighting

The Green-Lites™ series from O.C. White. The most energy efficient, highest output, longest lasting line of inspection lighting systems.
O.C. White Company

Rigid Flex That is Built to Last

Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.

IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director

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