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April 21, 2014
Welcome to IPC Outlook   »
CRM Upgrade   »
IPC Online Services Offline During CRM Upgrade
On Thursday, April 24, IPC will begin upgrading its CRM system. As a result, the IPC Online Store, Registration, and Manage My Account will be offline starting at 4:00 pm CT (21:00 GMT) on Thursday, April 24 through Sunday, April 27.
Standards, Technology and Manufacturing   »
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
Read an excerpt from the paper that took top honors in the U.S. category as selected by the IPC APEX EXPO® 2014 Technical Program Committee.
IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard
IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard
IPC, working in partnership with AIAG, CFSI and JEITA, recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.
IPC Crowns Winner of Hand Soldering WORLD CHAMPIONSHIP
IPC Crowns Winner of Hand Soldering WORLD CHAMPIONSHIP
On March 27, Brian Wade, CAMtek Inc. (United States), was crowned IPC hand soldering world champion, earning him a $1,000 cash prize, a new Metcal soldering station and bragging rights as the world's best hand solderer.
Conflict Minerals   »
SEC Updates Conflict Minerals FAQs
SEC Updates Conflict Minerals FAQs
The U.S. Securities and Exchange Commission (SEC) updated its Dodd-Frank FAQs webpage with an additional nine questions pertaining to conflict minerals.
Volunteer Recognition   »
Renee Michalkiewicz Elected to Chair Top IPC Standards Leadership Committee
Renee Michalkiewicz Elected to Chair Top IPC Standards Leadership Committee
Renee Michalkiewicz, MIT, general manager, Trace Laboratories, Baltimore, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
Six Industry Experts Receive IPC President's Award
In recognition of their significant contributions of time and talent and ongoing leadership in IPC and the industry, six long-time IPC volunteers earned IPC President's Awards.
EH&S   »
Changes to RoHS Directive will Impact your Company
Changes to RoHS Directive will Impact your Company
At the IPC and ITI seminar on Critical and Emerging Product Environmental Requirements, UK government experts Steve Andrews and Chris Smith, will provide real-time updates on changes to the RoHS Directive, as well as insight into the REACH and WEEE Directives.
IPC Multimedia Training   »
Lead Free Hand Soldering for Through-Hole Components
Lead Free Hand Soldering for Through-Hole Components
Free Review
Explains the basics of through-hole hand soldering, from operator safety through solder joint acceptance criteria, using lead-free solder.
IPC Calendar   »
April 25, 28, 30, 2014 - England/Germany
IPC & EIPC Roadshow: Workshops on Failure Analysis and Reliability Testing
May 6, 8, 13, 15, 2014 - Locations throughout U.S.
IPC and ITI Critical and Emerging Product Environmental Requirements Seminars
May 19-22, 2014 - Bangalore, India
IPC APEX India™
May 28, 2014 - Singapore
IPC Southeast Asia High Reliability Conference
IPC Member Milestones   »
Keithley Instruments Inc. (Solon, Ohio) recently celebrated its 25th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

IPC Technet Twitter Facebook YouTube LinkedIn Blog
What Causes Wave Solder Bridging?
What Causes Wave Solder Bridging?
We are having lead bridging problems with our wave soldering system. How would you rank the likely causes and areas to investigate?
Board Talk
Gold Plated Hole Defects
Gold Plated Hole Defects
After wave soldering, there are often portions of the gold plated holes that still have exposed gold. What is the best way to insure we get full solder coverage on these gold plated holes?
Ask the Experts
High-performance Ultra-thin Capacitors
High-performance Ultra-thin Capacitors
A new technique allows the manufacture of capacitors with a capacitance density 2000X higher than those currently available. These ultra-thin capacitors could be used in PC boards.
Technology Briefing
David Heller talks about changing demands
David Heller talks about changing demands
Dave Heller discusses current SMT reflow innovations and future product roadmap at Apex 2013. Click here to watch...
Heller Industries
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Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
Reliability Assessment of Reballed BGAs
Reliability Assessment of Reballed BGAs
In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components.
Analysis Lab
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
This paper discusses the results of independent experiments to address aspects of successful Package on Package integration.
Materials Tech
Reliability of Low Silver, Lead-Free Joints
Reliability of Low Silver, Lead-Free Joints
The objective of this study is to assess the reliability under loading conditions of low silver solder solder pastes.
Analysis Lab
Boards Requiring Multiple Cleanings
Boards Requiring Multiple Cleanings
AXAREL® 750 Multipass Inline Defluxer removes residues without board damage in processes requiring multiple cleaning cycles. Learn more ...
Petroferm Inc.
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Zip-lock Bags vs. Heat Sealed Bags
Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
Ask the Experts
Cleanliness of Stencils and Misprinted Boards
Cleanliness of Stencils and Misprinted Boards
This paper covers how control of a stencil cleaner's cleaning ability is possible, but requires assiduous discipline in maintaining a preventative maintenance program.
Production Floor
How To Determine Stencil Thickness
How To Determine Stencil Thickness
On what basis is stencil thickness decided in the case of BGA's or fine pitch components? The Assembly Brothers dive in.
Board Talk
The Green Implosion
The Green Implosion
Why hasn't Clean Tech made more of an impact? The energy generated by solar, wind, and other so-called green energy technologies is simply too unreliable and too expensive to be practical. We'll explain.
Technology Briefing
Counterfeit components - MUST you know?
Counterfeit components - MUST you know?
MUST 3 Solderability testing can help identify counterfeit components. Compares the force measurement signatures quickly and easily.
Gen3 Systems Limited
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Head and Pillow SMT Failure Modes
Head and Pillow SMT Failure Modes
This paper describes critical factors affecting head and pillow and how to identify the root cause and give potential solutions to prevent the defect.
Analysis Lab
3 Steps To Solder Paste Selection
3 Steps To Solder Paste Selection
This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing.
Materials Tech
Pick and Place Placement Rate
Pick and Place Placement Rate
What is the best way to calculate, and verify the placement rate for a pick and place system prior to purchase?
Ask the Experts
The Static Charge Overload
The Static Charge Overload
A plastic molding plant had been running for less than a year. Suddenly parts began testing positive for an electrical charge. What caused it?
Mysteries of Science
Featured Webcast  »
Contamination and Defects #2
Contamination and Defects #2
This webcast consists of 10 individual program segments focused on contamination, defects and whiskers on electronics assemblies.
Sponsors   »
Indium Corporation SACM™ Soldering Alloy
Indium Corporation SACM™ Soldering Alloy
SACM™ solder alloy offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling.
Indium Corporation
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Online Manual for Rework, Repair & Assembly
Online Manual for Rework, Repair & Assembly
From component identification to a complete index of industry terms and definitions, the manual covers everything you need to know.
PACE Incorporated
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New Metcal HCT2-120 Hot Air Pencil
New Metcal HCT2-120 Hot Air Pencil
The new Digital Hot Air Pencil is ideal for applications which use smaller components and allows more rework access without affecting adjacent parts.
OK International
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High Speed VLST
High Speed VLST
Getech High Speed Component Test Is a High speed BGA test handler that incorporates Vision Inspection, High Contact Pressure, Dual Tip handling. Learn more...
Getech
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Underfilling Using Continuous Path Motion
Underfilling Using Continuous Path Motion
White paper for underfill applications and using continuous motion of the dispense head to avoid backtracking and improve units per hour by 27%. Download now.
Nordson ASYMTEK
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Circuitry and PTH Repair on Multilayer PCBs
Circuitry and PTH Repair on Multilayer PCBs
Learn about services to repair severe damage to conductors and plated holes, including damaged holes in multilayer PCBs.
Circuit Technology Center
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4 Events - 1 Roof - April 8-10, 2014
4 Events - 1 Roof - April 8-10, 2014
The UK's largest event covering design, test, components, production, EMS, embedded and software. Learn more...
National Electronics Week
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Benefits of Electrolytic Solder
Benefits of Electrolytic Solder
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.
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Why settle for a Tower instead of Fortress?
Why settle for a Tower instead of Fortress?
Introducing the future in Intelligent Storage Management Systems. Guarantees to keep components safe while allowing for easy and intelligent management of critical inventory. Learn more...
Juki Automation Systems, Inc.
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Repeatable Dispensing from your Pump
Repeatable Dispensing from your Pump
Trouble with dispense repeatability from beginning of cartridge to the end ? A system that compensates for these issues automatically is available. Learn more...
GPD Global
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When Quick Turn Matters: Call NPI!
When Quick Turn Matters: Call NPI!
Electronic Manufacturing Services from Prototype to Low Volume to Full Production. Designed and delivered to your door with the ease of one PO.
NPI Services
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eSurface is the Game Changer for the PCB Industry
eSurface is the Game Changer for the PCB Industry
eSurface enables you to: • Achieve Ultra-fine capability < 1/1 L/S; • Dramatically improve yields; • Reduce steps & cycle times; • Maximize efficiency
eSurface
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Supremely Suited for Circuit Boards
Supremely Suited for Circuit Boards
Rapid curing 3HTND-1SM, one part surface mount adhesive used for optimal bonding performance in design, production, repair, maintenance and field service.
Master Bond
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