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 IPC OUTLOOK Logo
February 10, 2012
Welcome to IPC Outlook   »

IPC Standards   »
IPC and JEDEC Release C Revision of IPC-JEDEC-J-STD-033C
IPC and JEDEC Release C Revision of IPC-JEDEC-J-STD-033C
IPC and JEDEC have released IPC-JEDEC-J-STD-033C, Handling Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components.
Soldering & Assembly Defects   »
Exploring the Causes and Cures of Soldering and Assembly Defects
Exploring the Causes and Cures of Soldering and Assembly Defects
View this free webinar as Bob Willis, SMART Group, discusses the causes and cures of soldering and assembly defects.
Market Research   »
IPC Releases PCB Industry Results: Book-to-Bill Ratio Strengthens
IPC Releases PCB Industry Results: Book-to-Bill Ratio Strengthens
IPC announces the December findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Business Conditions Update   »
Industry Growth Slowed in 2011 with Signs of Recovery at Year End
The slowdown in sales growth that characterized most of 2011 for the North American EMS and PCB industries is leveling off, according to findings from IPC's monthly statistical programs.
IPC APEX EXPO®   »
Printed Electronics Coming of Age at IPC APEX EXPO 2012
Printed Electronics Coming of Age at IPC APEX EXPO 2012
A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO.
IPC Member Milestones   »
New IPC members and companies celebrating membership anniversaries.
Honeywell FM&T recently celebrated its 45th year as an IPC member.Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.
IPC Events   »
IPC Issues a Call for Participation and Sponsorship for 2012 Events
IPC Issues a Call for Participation and Sponsorship for 2012 Events
Contribute your knowledge and show your expertise by presenting your technical work and/or promotional pieces at various IPC-sponsored conferences.
IPC Multimedia Training   »
Soldering Iron Tip Care
Soldering Iron Tip Care
With tips costing from $10 to over $100, this IPC training video can reduce the cost of process consumables and increase product quality. Free Review
IPC Blog   »
Military Cuts Will Have Varied Impact
Wanted: Expert Speakers - Make Plans for 2012 Today
Building Long-term Reliability into Printed Circuit Boards
IPC Calendar   »
February 7, 2012
Webinar - Troubleshooting SMT-BGA-BTC Yield Problems in a Tin-Lead & Lead-Free World
February 8, 2012
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Webinar - Life After the Super Committee Deadline: What Now?
IPC Outlook Statistics   »
Programs: 750+
Directory Listings: 1300+
IPC Members: 3100+
Newsletter Subscribers: 100,000+

Sandy Gentry, Editor
Kim Sterling, Publisher
Neal Bender, Membership Director
Migrating to Paperless Work Instructions
Migrating to Paperless Work Instructions
A paper environment does not provide the nimbleness needed to execute today's adaptive business models.
Supply Chain
False Tin Whiskers: Masquerading Intermetallic
False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering details during root cause analysis.
Analysis Lab
Solderability Problems at Low Humidity
Solderability Problems at Low Humidity
Can very low humidity effect solderability of PCB assemblies. Are there other concerns when working in very low humidity?
Board Talk
Surface Mount and BGA Pad Repair... Really?
Surface Mount and BGA Pad Repair... Really?
 Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
Circuit Technology Center
Evaluation of Lead-free Solder Pastes
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free solder paste material for volume manufacturing uses.
Materials Tech
Epoxy Bonding Problems on RoHS Boards
Epoxy Bonding Problems on RoHS Boards
We are having problems with epoxy bonding to RoHS boards. Is there something about RoHS boards that make them more difficult to bond?
Ask the Experts
Hot Air Solder Leveling in the Lead-free Era
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected with a properly applied HASL finish.
Materials Tech
pH Neutral vs. Alkaline Cleaning Agents
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Analysis Lab
Ultrasonic Cleaning Causing Damage
Ultrasonic Cleaning Causing Damage
What method can be used to prevent damage to sensitive SMT components during the ultrasonic cleaning process?
Ask the Experts
New Technologies for Ultra Thin Chips
New Technologies for Ultra Thin Chips
Paper shows different approaches to use ultra-thin chips for new packages with high density and improved performance.
Materials Tech
Removing Flux from Low Standoff Heights
Removing Flux from Low Standoff Heights
Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues from beneath low standoff height components.
Production Floor
Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGA components using an ultrasonic cleaner followed by baking to remove any moisture. The components appear very clean after this process. Is this an acceptable practice for cleaning reballed PGA components?
Board Talk
Breakthrough Material Leads to Cheap Energy
Breakthrough Material Leads to Cheap Energy
Photosynthesis is considered the "Holy Grail" in the field of sustainable energy. A breakthrough material could lead to cheap, "green" energy.
Technology Briefing
Solder Deposits During Wave Soldering
Solder Deposits During Wave Soldering
During wave soldering, is there a possibility for solder to deposit on SMT components or cause a solder bridge between component pins?
Ask the Experts
Can Money Buy Happiness?
Can Money Buy Happiness?
Can money buy happiness? According to new research at Princeton University, it depends on the individual.
Technology Briefing
Problems With Viscosity and the Moon
Problems With Viscosity and the Moon
At an English shampoo factory near the sea, they were having problems with the shampoo viscosity. What was the cause?
Mysteries of Science
Comments   »
Shelf Life Before Conformal Coating
Feb 3, 2012 - Barry Ritchie has it nailed. Surface moisture is the enemy of conformal coating, but absorbed ...
Richard Stadem, General Dynamics, USA
Shelf Life Before Conformal Coating
Feb 1, 2012 - Boards should be typically baked out prior to conformal coating to drive off any ambient ...
Barry Ritchie, Dow Corning, USA
Shelf Life Before Conformal Coating
Feb 1, 2012 - Other factors to consider when determining the amount of time between processing and coating are ...
Michael Marzec, Rockwell Collins, Inc, USA
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
Lead-free Compatible Selective Soldering
Lead-free Compatible Selective Soldering
 The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems
Featured Webcast   »
Digitization Enables the Transformation of Our Society
Digitization Enables the Transformation of Our Society
The most invisible revolution in history, the Digital Revolution, is taking place all around us. Unlike the Industrial Revolution, the "fifth techno-economic revolution" is happening out of sight and behind the scenes. What are the implications? What do you need to know to make the most if it?
Featured Sponsors   »
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
 Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
 Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute image
Ultimate Solution for Placement Flexibility
Ultimate Solution for Placement Flexibility
 The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
Internationally Recognized Training
Internationally Recognized Training
 Train with the leading provider of IPC Certification, on-site or throughout US & Canada. Download the 2012 Schedule of all the IPC Programs...
EPTAC
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK image
Pick & Place Industry's Best Warranty
Pick & Place Industry's Best Warranty
 Does your equipment supplier stand behind the quality and reliability of their pick & place machines with a 5-year parts / 2-year labor warranty? Learn more...
Europlacer image
Compact Reflow Oven with KIC
Compact Reflow Oven with KIC
 Space-saving 6 1/2 ft. long, 16" pin conveyor over 20" mesh belt. Computer-controlled, four convection heat zones, lead-free. Includes KIC "Auto Focus Power". $22,995 · CR-4000C INFO
Manncorp
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Sandy Gentry, Editor | Kim Sterling, Publisher
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