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September 2, 2014
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Standards, Technology & Manufacturing   »
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated
IPC has released the F revisions of two of the industry's most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
IPC and IEC Establish Closer Working Ties to Further Printed Electronics Industry
IPC and IEC Establish Closer Working Ties to Further Printed Electronics Industry
The International Electrotechnical Commission's (IEC's) Standardization Management Board (SMB) recently "... approved the category D liaison between IEC TC 119 WG 2 and IPC ..."
Teresa Rowe Aims to Help Committee Chairs Grow
Teresa Rowe Aims to Help Committee Chairs Grow
Recently, Rowe joined IPC as director of assembly and standards technology. Along with directing the development of standards for electronics assembly materials and processes, she'll be supporting committee chairmen.
Market Research   »
Participate in IPC's North American Labor Pool Survey
Participate in IPC's North American Labor Pool Survey
IPC is conducting an in-depth study of the North American labor pool to assess how well it meets the needs of electronics manufacturers, identify and verify the gaps, and discover how manufacturers are overcoming recruitment challenges.
North American PCB Business Reflects Normal Seasonal Slowdown
North American PCB Business Reflects Normal Seasonal Slowdown
IPC announces the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders were weaker in July, but the book-to-bill ratio held steady at parity.
IPC TechSummit   »
Reliability. Innovation. Leadership
Reliability. Innovation. Leadership
IPC presents three, two-day conferences running at the same time, in the same place, October 28-30, 2014 in Raleigh, N.C. The event will focus on the cornerstones of success in today's electronics industry: reliability, innovation, leadership.
High Reliability   »
IPC Europe High Reliability Forum Covers Reliability of Today's High Technology Electronics Products
IPC Europe High Reliability Forum Covers Reliability of Today's High Technology Electronics Products
Co-developed by senior technologists from top organizations, the IPC Europe High Reliability Forum will explore critical reliability issues facing electronics designers and manufacturers.
Get Practical Information on Cleaning and Coating Issues
Get Practical Information on Cleaning and Coating Issues
Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.
IPC Multimedia Training   »
Overview of Electronics Assembly
Overview of Electronics Assembly
Free Review
A detailed intro to electronics assembly for new employees and technical/vocational schools.
IPC Calendar   »
Sept. 28-Oct. 2, 2014 - Rosemont, Ill.
Co-located with SMTAI

IPC Fall Standards Development Committee Meetings
October 14-15, 2014 - Düsseldorf, Germany
IPC Europe High Reliability Forum
October 28-30, 2014 - Raleigh, NC
IPC Tech Summit
November 18-20, 2014 - Chicago, Ill.
High-Reliability Cleaning and Conformal Coating Conference
December 3-5, 2014 - Shenzhen, China
International Printed Circuit and APEX South China Fair (HKPCA & IPC Show)
IPC Member Milestones   »
Dow Electronic Materials (Marlborough, Mass.) recently celebrated its 20th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

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Issues With Fillets on Via Holes?
Issues With Fillets on Via Holes?
When we wave solder our circuit boards, some of the vias have concave fillets giving them a dimple effect. We are having problems when we test using our flying probe system. What can we do to create flatter fillets on via holes?
Board Talk
Soldering Station Calibration
Soldering Station Calibration
When our company purchased new soldering stations two years ago we were told that they do not require calibration. I believe that all soldering stations should be calibrated and re-calibrated after some point? Do you agree?
Ask the Experts
Thin, Flexible, Hyper-resolution Displays
Thin, Flexible, Hyper-resolution Displays
A team has discovered a way to create pixels just a few hundred nanometers across. This could pave the way for thin, flexible, hyper-resolution, low-energy displays and foldable screens.
Technology Briefing
MBT-350: A Complete, All-In-One, Rework Station
PACE
The MBT-350 includes 3 individual channels and is capable of delivering hot air and solder suction all at an affordable price.
PACE Incorporated
Outsmarting Waste in Electronics
Outsmarting Waste in Electronics
Pamela Gordon of Technology Forecasters reflects on how the electronics industry can help outsmart waste while still enjoying profitability.
Supply Chain
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress caused by electromagnetic interference, or electrical noise, on power lines and ground in the manufacturing environment.
Analysis Lab
Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Paper provides a general description of flux and the role of their constituting ingredients. Plus the development of a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech
Tips for Rework of Large Scale BGA Components
Tips for Rework of  Large Scale BGA Components
You've just been given a circuit board with a shorted BGA site. Yes, it's complicated enough, but in this case the challenge is magnified as this BGA component has 2600 solder balls.
Production Floor
Quick Curing Epoxy Withstands Chemicals
Master Bond, Inc.
EP3RRLV is a one-part low viscosity epoxy for high performance potting, encapsulation & underfill, withstands heat, thermal cycling, mechanical vibration and shock.
Master Bond
Solder Paste Past Shelf Life
Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4 degree Celsius for more than 8 months. The shelf life is 6 months. Can it be used?
Ask the Experts
Failure Modes in Wire Bonded and Flip Chip Packages
Failure Modes in Wire Bonded and Flip Chip Packages
Paper provides overview of typical defects and failure modes seen in flip chip package assembly, and reviews efforts needed to understand new failure modes during assembly.
Analysis Lab
Is There a Test for Black Pad?
Is There a Test for Black Pad?
We have identified black-pad and are concerned it may extend to assembled PCBs. Is there a nondestructive test that can be performed on assemblies?
Board Talk
Digitally Enabled Independence
Digitally Enabled Independence
The conventional wisdom of the mass-production revolution is being replaced by a new paradigm favoring customization and decentralization. Why is this happening now? What are the implications? How can you profit? We'll show you.
Technology Briefing
ZEISS Smartzoom 5 - Sample Simple
ZEISS
ZEISS Smartzoom 5, a digital microscope ideally suited for QA applications in fields of industry, provides SMART design, workflow and output.
Carl Zeiss Microscopy, LLC
Material Selection for Reliable TMV Pop Assembly
Material Selection for Reliable TMV Pop Assembly
The work presented here investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly.
Materials Tech
Precision Cleaning in the 21st Century
Precision Cleaning in the 21st Century
This paper details the development of an environmentally friendly, non-flammable cleaning solvent with very low global warming potential.
Production Floor
Cause of BGA Solder Joint Bridging
Cause of BGA Solder Joint Bridging
How do you find the root cause of BGA bridging? We are seeing two different bridging areas: one is in the corner and the other is in the center of the array?
Ask the Experts
The Puzzling Z-Axis Adhesive
The Puzzling Z-Axis Adhesive
A new type of z-axis conductive adhesive was mysteriously switching on and off. The cycle was endlessly repeated. What was the cause?
Mysteries of Science
Sponsors   »
03015 to 6" Connector Placement
Panasonic
SPI, dispensing, placement, and AOI along with fast 3D multi-recognition vision – say hello to NPM-D3.
Panasonic Factory Solutions Company of America
Metcal On Tour Rework Workshops
OK INTERNATIONAL
The workshops will provide tips to unlock the challenges of rework with live Applications for: PoP / QFN / QFP / 0201 / LED / PTH. Register today.
OK International
UV Conformal Coatings with Moisture Cure
Dymax
Dymax light-cure conformal coatings, for high-density PCBs with shadow areas, cure with ambient moisture over time. Download Conformal Coating guide.
DYMAX Corporation
Simple and efficient - vapor phase soldering
Asscon
This process stands for easy and flexible setup of temperature profiles. It saves time and money and assures a constant excellent product quality - from prototype to inline mass production.
ASSCON
Circuitry and PTH Repair on Multilayer PCBs
CTC
Learn about services to repair severe damage to conductors and plated holes, including damaged holes in multilayer PCBs.
Circuit Technology Center
Thermal Management Products
Electrolube
Applications for thermally conductive material have increased as electronics become more complex and powerful. Learn more about the range of thermal management solutions.
Electrolube Ltd
Benefits of Electrolytic Solder
Metallic Resources
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.
eSurface is the Game Changer for the PCB Industry
eSurface
eSurface enables you to: • Achieve Ultra-fine capability < 1/1 L/S; • Dramatically improve yields; • Reduce steps & cycle times; • Maximize efficiency
eSurface
High Temperature Electronics Production
Petroferm
Removing burnt on RA flux residues from HMP alloys without tarnishing the joints is a challenge. Our cleaners solve this puzzle. Learn more ...
Petroferm Inc.
Discover New Facts About Parylene Coating
Diamond MT
Learn about the parylene deposition process, the main benefits of parylene, and the most common applications of parylene in a new free fact sheet titled Parylene 101 from Diamond-MT.
Diamond MT
A World of Reflow Soldering Solutions
Vitronics Soltec
Vitronics Soltec's reflow ovens provide unmatched ease of use. Esterline Technologies says their XPM3i reflow "is an engineer's dream come true!"

Vitronics Soltec
Achieve Faster Cure Times with UV/Light
Ellsworth
For rapid curing of chemicals used in electronics assembly, Ellsworth Adhesives recommends light-curable chemicals and curing equipment from Dymax.
Ellsworth Adhesives
They didn't think it could be done, we proved them wrong
Advanced Assembly
Proprietary system delivers consistent, machine SMT assembly for low-volume boards in 1-5 days. It's our only focus.
Advanced Assembly LLC
When failure cannot be tolerated, trust IEC
IEC
Your high-reliability electronics must work as intended without failures. Choose IEC as your most trusted source for electronic manufacturing services.
IEC Electronics Corp.
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