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October 22, 2014
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Standards, Technology & Manufacturing   »
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions
Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions
In this Technical Spotlight video, Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies.
Zentech Manufacturing First to Earn Certification as Qualified Manufacturer to IPC J-STD-001 Space Addendum
Zentech Manufacturing First to Earn Certification as Qualified Manufacturer to IPC J-STD-001 Space Addendum
IPC's Validation Services Program has awarded an IPC J-STD-001 Space Addendum Qualified Manufacturers Listing (QML) to Zentech Manufacturing Inc., an electronics and engineering service firm in Baltimore, Md.
Market Research   »
Many Factors Contribute to Upbeat North American PCB Outlook
Many Factors Contribute to Upbeat North American PCB Outlook
The North American PCB industry is increasing its production and spending more on R&D. Those are just a couple of the upbeat data points in the IPC's 2013-2014 Analysis & Forecast for the PCB Industry in North America report.
Conflict Minerals   »
Experts Question Conflict Minerals Action
Experts Question Conflict Minerals Action
A recent open letter by a group of 70 policy experts from around the world questions the benefits of the focus on conflict minerals.
IPC TechSummit   »
Effective Tin Whisker Prevention --- Their Causes and How to Prevent Them
Effective Tin Whisker Prevention --- Their Causes and How to Prevent Them
Dr. Werner Hügel, Robert Bosch GmbH, will present "Whisker Prevention and the Relevance of Plating Conditions" during the CALCE Annual Tin Whiskers Symposium at IPC TechSummit.
IPC TechSummit 2014
IPC presents three conferences in one place, October 28-30, 2014 in Raleigh, N.C. A world-class learning forum for staff, managers, and executives in educational sessions, networking, discussions with subject-matter experts.
IPC APEX EXPO   »
Highlight Your Research at the Premier Industry Event, IPC APEX EXPO
Highlight Your Research at the Premier Industry Event, IPC APEX EXPO
Show a technical poster at the industry's premier conference on electronics manufacturing and gain significant visibility for you and your company on your research and knowledge. Deadline for abstracts: November 4, 2014.
Cleaning & Coating   »
Get Practical Information on Cleaning and Coating Issues
Get Practical Information on Cleaning and Coating Issues
Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.
IPC Multimedia Training   »
The Seven Sins of Surface Mount Assembly
The Seven Sins of Surface Mount Assembly
Free Review
Focuses on seven major problem areas during SMT assembly, explaining potential problems and typical causes.
IPC Calendar   »
October 28-30, 2014 - Raleigh, NC
IPC Tech Summit
November 18-20, 2014 - Chicago, Ill.
High-Reliability Cleaning and Conformal Coating Conference
December 3-5, 2014 - Shenzhen, China
International Printed Circuit and APEX South China Fair (HKPCA & IPC Show)
February 24-26, 2015 - San Diego, Calif.
IPC APEX EXPO®
IPC Member Milestones   »
BAE Systems Inc. (Nashua, N.H.) recently celebrated its 30th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

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Going Lead Free with Vapor Phase Soldering
Going Lead Free with Vapor Phase Soldering
Many companies have not found the right solutions to change over to lead free yet. Vapor phase reflow soldering can be an answer.
Production Floor
A New Method to Forecast Drop Shock Performance
A New Method to Forecast Drop Shock Performance
The intent of this paper is to identify an accurate method to predict drop test behavior by understanding the surface tension of both, the solder mask ink and the underfill material.
Analysis Lab
Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech
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Connecting a Trillion Battery-Free Devices
Connecting a Trillion Battery-Free Devices
Engineers have designed a new communication system that uses radio frequency signals as a power source and reuses existing Wi-Fi infrastructure to provide Internet connectivity to battery-free devices.
Technology Briefing
Going Beyond Your Solder Paste Work Life?
Going Beyond Your Solder Paste Work Life?
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk
HASL vs. Immersion Gold
HASL vs. Immersion Gold
We make electronic equipment used in corrosive environments. Experts suggest we use hot air solder leveling (HASL) as a finish on circuit boards instead of immersion gold. What do you suggest?
Ask the Experts
Via Filling: Challenges in the Plating Process
Via Filling: Challenges in the Plating Process
This paper describes the function and principles behind BMV filling processes together with methods for non destructive testing of the filled structures.
Production Floor
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Solder Bridging Problem on Header Connector
Solder Bridging Problem on Header Connector
We have been struggling to eliminate solder bridging during wave soldering on a 10 x 2 row through hole header connector. Do you have any suggestions?
Ask the Experts
Creep Corrosion of PWB Final Finishes
Creep Corrosion of PWB Final Finishes
This paper demonstrates that creep corrosion on a PWB is highly surface sensitive.
Analysis Lab
Problems With Starved "J" Lead Joints
Problems With Starved
We have insufficient solder joint heel fillets with a PLCC J lead component. We cannot increase the stencil thickness due to the presence of T SOPS and QFP packages. What do you advise?
Board Talk
Are the Days of Copper Circuits Numbered?
Are the Days of Copper Circuits Numbered?
Academia are vigorously researching new candidates to succeed traditional copper as the material of choice for interconnects on computer chips.
Technology Briefing
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What Manufacturers Procrastinate Most
What Manufacturers Procrastinate Most
Perhaps tech manufacturers procrastinate creating detailed disaster-preparedness-and-recovery plans because they think that building collapses and fires happen only in lower-tech industries.
Supply Chain
Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper includes details of mechanical and reliability testing of joints made with these materials under a range of temperature, pressure and atmosphere conditions.
Materials Tech
Which Term To Use - PWB or PCB?
Which Term To Use - PWB or PCB?
Is there any real difference between the terms Printed Wire Board and Printed Circuit Board? Which do you recommend?
Ask the Experts
Cloudy Copper Plating Bath
Cloudy Copper Plating Bath
At a circuit shop near Los Angeles there was trouble with the copper plating line. Was an impurity getting in the tank and how?
Mysteries of Science
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