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The Knowledge and Know-how Connection
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July 22, 2014
Welcome to IPC Outlook   »
Standards, Technology and Manufacturing   »
Solderability Testing (Process Simulation) on Components
Solderability Testing (Process Simulation) on Components
In this technical spotlight video, industry expert Bob Willis uses the NPL Defect Database to demonstrate solderability testing on components.
Government Relations   »
IPC Provides Feedback to DoD on Flexible Hybrid Electronics and Electronic Packaging and Reliability
IPC Provides Feedback to DoD on Flexible Hybrid Electronics and Electronic Packaging and Reliability
On July 14, IPC submitted two responses to the DoD Request for Information to pursue advanced manufacturing centers in flexible hybrid electronics and electronic packaging and reliability.
Congressman Glenn Thompson Tours Chemcut Facility in Pennsylvania
Congressman Glenn Thompson Tours Chemcut Facility in Pennsylvania
Congressman Glenn Thompson visited Chemcut Corporation, an IPC-member company in State College, Pa. The meeting was part of an effort to help policymakers learn first-hand about legislative and regulatory issues that impact the electronics industry.
IPC Outlook   »
Share your Opinions on IPC Outlook
Share your Opinions on IPC Outlook
Help us make IPC Outlook more valuable to you! Complete a brief survey and get a chance to win one of five registrations to IPC TechSummit™.
High Reliability    »
IPC Southeast Asia to Host High Reliability Conference
IPC Southeast Asia to Host High Reliability Conference
Industry experts representing every market sector will discuss solder technology, cleaning and test and inspection strategies at this free one-day event, being held August 20 in Penang, Malaysia.
Find Reliability Solutions at the IPC Europe High Reliability Forum
Find Reliability Solutions at the IPC Europe High Reliability Forum
Co-developed by senior technologists from top organizations - Airbus, The European Space Agency, Robert Bosch, Thales and more - this Forum will explore critical reliability issues facing European electronics designers and manufacturers.
IPC Events   »
Sign up for IPC Event Updates
Sign up for IPC Event Updates
Keep up to date on new IPC show activities and special promotions by completing an online IPC Events Update Form.
New Releases   »
Standards, Translations, Market Research...
Standards, Translations, Market Research...
View recently released standards including IPC-1755, IPC-4103A, IPC J-STD-030A, and IPC-6013C; translations; market research documents; multimedia presentations; technical papers and more.
Status of Standardization   »
Standards for Ballot and Final Drafts
View IPC documents under development.
IPC Multimedia Training   »
Wire Preparation
Wire Preparation
Free Review
The basics of wire processing and evaluation from manual through automatic.
IPC Calendar   »
August 20, 2014 - Penang, Malaysia
IPC Southeast Asia High Reliability Conference
Sept. 28-Oct. 2, 2014 - Rosemont, Ill.
Co-located with SMTAI

IPC Fall Standards Development Committee Meetings
October 14-15, 2014 - Düsseldorf, Germany
IPC Europe High Reliability Forum
October 28-30, 2014 - Raleigh, NC
IPC Tech Summit
IPC Member Milestones   »
Aselsan Electronic Ind. Inc. (Ankara, Turkey.) recently celebrated its 20th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

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Will Nitrogen Reduce Wave Solder Defects?
Will Nitrogen Reduce Wave Solder Defects?
Our current defective parts-per-million level for soldering is 400-500. We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defects-per-million level?
Board Talk
Reflow Causing Warp
Reflow Causing Warp
We have a 20 layer PWB that bows during reflow. Other than a better design, what can be done prior to reflow, during reflow, or post reflow, to prevent the board from warping?
Ask the Experts
Drop Test Performance of BGA Assemblies
Drop Test Performance of BGA Assemblies
In this work, BGA solder spheres using SAC105 with 0.02% addition of Titanium were evaluated for BGA assembly drop test performance.
Analysis Lab
Boards Requiring Multiple Cleanings
Petroferm
AXAREL® 750 Multipass Inline Defluxer removes residues without board damage in processes requiring multiple cleaning cycles. Learn more ...
Petroferm Inc.
A Robot's Place in SMT
A Robot's Place in SMT
The majority of SMT machines today are designed to pick and place from tape, tray, and sticks. There are also parts without packaging. Robots can handle these unique placements far more efficiently than an operator working on his own.
Production Floor
The Automation of American Jobs
The Automation of American Jobs
Since the Industrial Revolution, the specter of the machine as a destroyer of jobs has haunted workers. Today nearly half of American jobs are at risk. What are the implications? We'll explain.
Technology Briefing
Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
This paper will outline how the Electrical Test industry combats these requirements and provides solutions to adhere to these ever changing requirements.
Materials Tech
Ten Rules for Jumper Wires
Ten Rules for Jumper Wires
The need to attach jumper wires to circuit board assemblies is inevitable. This program covers 10 key rules for attaching jumper wires to assembled circuit boards.
Production Floor
Edgebond Adhesive Reinforces BGAs & CSPs
Dymax
Dymax 9309-SC light-curable adhesive is ideal for PCB applications where rapid ruggedization of critical components is needed. Request product sample.
DYMAX Corporation
Bromine Free PWBs
Bromine Free PWBs
What are the pros and cons of bromine in PWBs? Are bromine and lead free connected?
Ask the Experts
Pb-Free Thermal Cycle Acceleration Factors
Pb-Free Thermal Cycle Acceleration Factors
Paper discusses the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb.
Analysis Lab
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Mechanically, thermally, chemically, a combination of these methods. Is there an industry approved method?
Board Talk
New Transistor Mimics the Brain
New Transistor Mimics the Brain
Scientists at the Harvard School of Engineering and Applied Sciences have created a new type of transistor that mimics the behavior of a brain synapse.
Technology Briefing
Through Hole Expertise
ECD
Through hole is here to stay but expertise is hard to find. ECD's WaveRIDER® NL2 puts wave soldering processes in control and the "golden board" to rest. Find out more.
ECD
Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials should be given serious consideration in printed electronics.
Materials Tech
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Paper presents performance of the profiled squeegee blade developed to create a multi-angle of attack for process control for all types of stencil printing processes.
Production Floor
Corrosive Driven Whisker Growth in SAC305
Corrosive Driven Whisker Growth in SAC305
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Analysis Lab
Cyanide Leak and Sleepy Chemists
Cyanide Leak and Sleepy Chemists
Chemists were found on the floor of a boxcar while unloading drums of sodium cyanide. What happened to the chemists, were they poisoned?
Mysteries of Science
Sponsors   »
When Quick Turn Matters: Call NPI!
NPI
Electronic Manufacturing Services from Prototype to Low Volume to Full Production. Designed and delivered to your door with the ease of one PO.
NPI Services
Low Viscosity, Epoxy Based UV Curing System
Master Bond, Inc.
Epoxy based UV15LV is a UV curable system for bonding, sealing and coating. Used for spin coating applications and cures quickly when exposed to a UV light.
Master Bond
Why settle for a Tower instead of Fortress?
JUKI
Introducing the future in Intelligent Storage Management Systems. Guarantees to keep components safe while allowing for easy and intelligent management of critical inventory. Learn more...
Juki Automation Systems, Inc.
Simple and efficient - vapor phase soldering
Asscon
This process stands for easy and flexible setup of temperature profiles. It saves time and money and assures a constant excellent product quality - from prototype to inline mass production.
ASSCON
Get PCBs FAST - With Zoom PCB!
Electronic Interconnect
Nobody does it faster than Ei! Prototype to Production, Single or Multi Layers, Instant quotes, you'll hardly believe it. Try us!
Electronic Interconnect
Higher Productivity with ACE
ACE Production Technologies
KISS Selective Soldering solutions from ACE are flexible, easy-to-use, and built for long life and low cost of ownership. Learn More!
ACE Production Technologies
SMT Assembly for Engineers
Advanced Assembly
We machine-place all SMT parts and our SMT assembly verification software finds errors before assembly begins, avoiding delays and saving you money.
Advanced Assembly LLC
Underfilling Using Continuous Path Motion
Asymtek
White paper for underfill applications and using continuous motion of the dispense head to avoid backtracking and improve units per hour by 27%. Download now.
Nordson ASYMTEK
Who Has the Toughest Component Rework?
CTC
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Circuit Technology Center
New IPC Certification App...
EPTAC
Finally an App to find an IPC Certification or Solder Training class near you. Interactive map, advanced searching all in your hand and all by EPTAC.
EPTAC
MIL-STD 883 & 750 Training from Blackfox
BLACKFOX
This course is designed to familiarize the learner with the details included in specific sections of the MIL-STD 883 Test Method Standard Microcircuits and MIL-STD 750.
Blackfox Training Institute
Online Manual for Rework, Repair & Assembly
PACE
From component identification to a complete index of industry terms and definitions, the manual covers everything you need to know.
PACE Incorporated
Benefits of Electrolytic Solder
Metallic Resources
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.
IPC Training Materials and more...
SOLDER TRAINING
From solder training kits, standards, videos, tools and more, the latest products you need to deliver your IPC Training Certification programs.
Soldertraining, Inc.
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