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August 20, 2014
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Standards, Technology & Manufacturing   »
IPC Solder Products Value Council White Paper Simplifies Comparison of Lead-free Alloys
IPC Solder Products Value Council White Paper Simplifies Comparison of Lead-free Alloys
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for evaluating new lead-free alloys.
HKPCA & IPC Show   »
Trade Show Pact Ensures "Building through Resilience"
Trade Show Pact Ensures
IPC has extended its trade show alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair (IPC & HKPCA Show) last year, the two agreed to co-host the event for four more years.
Conflict Minerals   »
Help Identify the Realities of Conflict Minerals Regulatory Compliance
Help Identify the Realities of Conflict Minerals Regulatory Compliance
Participate in Tulane University's conflict minerals post-filing survey to help identify the realities of Dodd-Frank Section 1502 regulatory compliance. The survey will remain open until an appropriate sample size is reached.
Fall Standards Meetings   »
IPC Committees Preparing for Fall Standards Meetings
 IPC Committees Preparing for Fall Standards Meetings
If you're interested in participating in the IPC Fall Standards Development Meetings, make your plans now to attend, September 28-October 2, in Rosemont, Ill.
Call for Papers   »
Present Your Work at IPC Conference on Assembly and Reliability
Present Your Work at IPC Conference on Assembly and Reliability
Present your work and make an impact at IPC Conference on Assembly and Reliability in Bangkok, Thailand. This event will take participants through the assembly process - from materials to test and inspection
High Reliability   »
Corrosion, CAF, BGA Cracking: Address These Reliability Issues at IPC Europe High Reliability Forum
Corrosion, CAF, BGA Cracking: Address These Reliability Issues at IPC Europe High Reliability Forum
Co-developed by senior technologists from top organizations, the IPC Europe High Reliability Forum will explore critical reliability issues facing European electronics designers and manufacturers.
How Clean is Clean?
How Clean is Clean?
Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.
IPC Events   »
Sign up for IPC Event Updates
Sign up for IPC Event Updates
Keep up to date on new IPC show activities and special promotions by completing an online IPC Events Update Form.
IPC Multimedia Training   »
Component Number Codes
Component Number Codes
Free Review
The simple way to teach number code calculations for resistors, capacitors and inductors.
IPC Calendar   »
Sept. 28-Oct. 2, 2014 - Rosemont, Ill.
Co-located with SMTAI

IPC Fall Standards Development Committee Meetings
October 14-15, 2014 - Düsseldorf, Germany
IPC Europe High Reliability Forum
October 28-30, 2014 - Raleigh, NC
IPC Tech Summit
November 18-20, 2014 - Chicago, Ill.
High-Reliability Cleaning and Conformal Coating Conference
IPC Member Milestones   »
PRI-DANA Elektronik A/S (Hedensted, Denmark) recently celebrated its 30th year as an IPC member. See other companies celebrating membership anniversaries. Invest in your company and experience the benefits of joining the industry's premier association. Learn more about IPC membership.

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Fatigue Behaviour of Reflowed Joints
Fatigue Behaviour of Reflowed Joints
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays and high density interconnect structures.
Analysis Lab
Fiber-optic Cable Breakthrough
Fiber-optic Cable Breakthrough
Pulses of light need to be lined up in a fiberoptic cable with a minimum distance between them. Now, a team has come up with a method for fitting pulses together within the fibers.
Technology Briefing
Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech
What Goes Around, Comes Around
Gen3
NEW Closed-Loop ROSE Testers - Fast, accurate and affordable process control to help avoid dendrites / corrosion / tin whiskers.
Gen3 Systems Limited
Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? As always, the Assembly Brothers Phil Zarrow and Jim Hall, Pick and Place, give a review.
Board Talk
Flux Oozing from Insulated Wires
Flux Oozing from Insulated Wires
Our wires are stripped and tinned. It appears that throughout the build cycle flux oozes out from under the insulation. We clean and find that flux seeps out again. What could cause this?
Ask the Experts
Assembly of POP with Novel Epoxy Flux on Solder Paste
Assembly of POP with Novel Epoxy Flux on Solder Paste
In this paper, a newly developed epoxy flux, that is compatible with solder paste, was evaluated for assembly and reliability.
Production Floor
Virtual Access Augments Test Coverage
Virtual Access Augments Test Coverage
Detecting open solder connections with electrical test techniques is a major challenge for manufacturers, primarily because of the erosion of test pads on these products.
Production Floor
NASA Low Outgassing Approved Epoxy
Master Bond, Inc.
Optically clear UV24TKLO one-component UV curable provides physical strength & electrical insulation properties. Chemical resistance to water, alcohols & solvents.
Master Bond
BGA Component Moisture Exposure
BGA Component Moisture Exposure
We mistakenly assembled boards using BGA components with moisture tags that show indication of moisture exposure. Can we rebake the assemblies?
Ask the Experts
Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
The results of this study demonstrate that the molded flip-chip BGA package is a cost effective and high reliability solution for 28nm FPGA devices.
Analysis Lab
Measuring Conformal Coating Adhesion
Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure. This paper reviews a new tape peel test that can be applied to the PCB or component surface.
Materials Tech
The Intelligent and Secure Factory Floor
The Intelligent and Secure Factory Floor
In the near future, products moving along a production line will know where they are, which steps are completed, and what is needed for completion.
Technology Briefing
Why Rigid Flex? The reliability of your circuitry
Printed Circuits, Inc.
Rigid Flex are designed for aerospace, medical and military reliability. Flex assemblies reduce connector and reliability issues. Learn more...
Printed Circuits, Inc.
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor
Mechanical Behavior of Bi-Containing Pb-Frees
Mechanical Behavior of Bi-Containing Pb-Frees
The objective of this research was to characterize the mechanical metallurgy of alternative solder alloys for high-reliability applications.
Analysis Lab
Delamination Causing Scrap
Delamination Causing Scrap
We have been experiencing delamination. Is there a way to definitively determine that the delamination is being caused by moisture vs. some other type of defect? Is it possible to repair delamination?
Ask the Experts
Resistor Values off the Mark
Resistor Values off the Mark
Suddenly values for screened resistors on ceramic circuits were way too high. What caused the sudden high values?
Mysteries of Science
Sponsors   »
Discover a Simple Solution for Damaged Conductors
CircuitMedic
When you have damaged conductors, there is a quick and reliable IPC recommended repair. The replacement conductor matches the original. Discover the secret.
CircuitMedic
Can you trust your EMS provider?
IEC
Reliability and trust is earned. IEC has become IPC's 1st QML Certified trusted source. Let us put our reputation to work for your EMS needs.
IEC Electronics Corp.
A World of Reflow Soldering Solutions
Vitronics Soltec
Vitronics Soltec's reflow ovens provide unmatched ease of use. Esterline Technologies says their XPM3i reflow "is an engineer's dream come true!"

Vitronics Soltec
Europlacer's NEW Intelligent Feeders - ii-Feed
Europlacer
ii-Feed is a fully 'intelligent', fast-loading feeder; enabling accurate tape indexing and optimum productivity. ii-Feed Elements are compatible with all Europlacer machines. Learn more...
Europlacer North America
Why Use Parylene Conformal Coating?
Diamond MT
Parylene is the ultimate conformal coating for the protection of devices, components and surfaces in the electronics industry. Learn more ...
Diamond MT
Stencil Cleaner Recommended for Durostone Pallets
Smart Sonic
Permali, makers of Durostone Pallet material, has tested Smart Sonic's ultrasonic stencil cleaners and 440-R SMT Detergent and recommends Smart Sonic for cleaning Durostone pallets.
Smart Sonic Corporation
AIM's New NC273LT Low Temperature Solder Paste
AIM Solder
Bismuth containing alloys provide assemblers with an innovative solution when temperature sensitivity is paramount.
Aim Solder
Through Hole Expertise
ECD
Through hole is here to stay but expertise is hard to find. ECD's WaveRIDER® NL2 puts wave soldering processes in control and the "golden board" to rest. Find out more.
ECD
New IPC Certification App...
EPTAC
Finally an App to find an IPC Certification or Solder Training class near you. Interactive map, advanced searching all in your hand and all by EPTAC.
EPTAC
Who Has the Toughest Component Rework?
CTC
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Circuit Technology Center
MBT-350: A Complete, All-In-One, Rework Station
PACE
The MBT-350 includes 3 individual channels and is capable of delivering hot air and solder suction all at an affordable price.
PACE Incorporated
Metcal On Tour Rework Workshops
OK INTERNATIONAL
The workshops will provide tips to unlock the challenges of rework with live Applications for: PoP / QFN / QFP / 0201 / LED / PTH. Register today.
OK International
Thermal Management Products
Electrolube
Applications for thermally conductive material have increased as electronics become more complex and powerful. Learn more about the range of thermal management solutions.
Electrolube Ltd
New High-speed Modular Chip-shooter
JUKI
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
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